Power Supply Module With Integrated PCB Windings
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Solution Overview
Problem
Current power supply modules with planar transformers have low power density and high impedance, leading to inefficiencies and space utilization issues, especially when powering intelligent ICs like CPU, GPU, and ASIC chips, due to vertical windings and large connection paths.
Innovation Solution
A power supply module design featuring a magnetic core assembly with horizontal and vertical windings integrated into the system board, using pins to connect windings and reduce height, improving current uniformity and efficiency, and incorporating a buck power supply module for voltage conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar transformer with vertical windings is used, then the structure is simple and easy to manufacture, but the current distribution is uneven and loss is large
Solution Approach 1:
The patent segments the winding structure into multiple independent winding sections (first winding section, second winding section, third winding section, fourth winding section) wound around separate magnetic columns. This segmentation allows each section to carry current more uniformly, reducing overall power loss while maintaining manufacturing simplicity through modular construction.
Solution Approach 2:
The patent transitions from traditional vertical windings to horizontal windings arranged in a planar configuration on the system board. This dimensional change from vertical to horizontal arrangement improves current distribution uniformity and reduces loss, while the windings are still formed using standard PCB trace techniques.
2Ease of operation
If the output connection path is long with copper blocks, then the terminals can be formed, but the impedance is large and efficiency is affected
Solution Approach 1:
The patent extracts and eliminates the copper block connection structure from the design. Instead of using copper blocks with long connection paths, the windings are directly formed using PCB traces that integrate the connection path into the board structure, significantly reducing impedance and improving efficiency.
Solution Approach 2:
The patent merges the winding structure with the system board by forming windings directly on the PCB using standard trace techniques. This integration combines the terminal connection function with the winding function, eliminating separate copper blocks and reducing the overall connection path length and impedance.
3Volume of moving object
If the power module height is increased, then more space is available for components, but the space utilization on the system board is reduced
Solution Approach 1:
The patent adopts a low-profile design where windings are formed horizontally on the system board plane rather than extending vertically. This dimensional arrangement allows components to be distributed more efficiently across the board area, improving space utilization while maintaining adequate component space through optimized layout.
Solution Approach 2:
The patent employs a flexible layout approach where the winding traces and component positions can be dynamically optimized on the system board. This allows the design to adapt to available space, maximizing board area utilization while ensuring sufficient space for all necessary components through careful arrangement.
4Power
If the power density is increased, then the current output capability is improved, but the impedance and loss increase
Solution Approach 1:
The patent segments the high-current path into multiple parallel winding sections, each carrying a portion of the total current. This segmentation allows the system to achieve high current output capability through parallel conduction paths while reducing the current density and associated losses in each individual trace, thereby improving overall power efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves higher power density, reduced height, and improved efficiency by integrating windings into the system board and using a buck power supply module for intelligent ICs, addressing the inefficiencies and space constraints of traditional modules.
Implementation Method 1
a magnetic core assembly including: a first magnetic column, and a second magnetic column; a first winding unit including: a first winding portion wound around the first magnetic column, and a second winding portion wound around the second magnetic column
Data Source
AI summary
A power supply module includes a power supply submodule, a plurality of pins, and a second winding unit. The power supply submodule includes a switch, a magnetic core assembly, and a first winding unit including a first winding portion and a second winding portion. The second winding unit includes a third winding portion connected to the first winding portion via some of the plurality of pins to form a first winding, and a fourth winding portion connected to the second winding portion via some of the plurality of pins to form a second winding. The magnetic core assembly, at least the first winding, and the second winding form a magnetic element. The switch is disposed on and electrically connected to the magnetic element. At least one of the plurality of pins is an output pin via which the power supply module powers an intelligent IC load.