Multi-Side EMI Shielding and Cooling in Power Supply Modules
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Solution Overview
Problem
Existing power-supply modules face inefficiencies due to inadequate EMI shielding, inefficient cooling, and high-resistance electrical connections, particularly with components mounted on multiple levels or single-sided shielding, which affects power-conversion efficiency and performance.
Innovation Solution
The implementation of a power-supply module design with multi-side EMI shielding and cooling, utilizing a platform and lead frame on both sides of the module to provide comprehensive EMI protection and efficient heat dissipation, along with shorter electrical paths using clips and inner leads to reduce resistance and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If components are mounted on multiple levels or single-sided shielding is used, then device complexity is reduced, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The EMI shielding structure is segmented into multiple independent shielding regions located at different sides of the package (front, rear, and/or side walls). Each shielding region can be independently implemented on different sides rather than requiring a complete enclosing shield, reducing overall complexity while maintaining effectiveness.
Solution Approach 2:
EMI shielding is applied locally at specific sides of the package where components are mounted, rather than implementing uniform shielding across the entire device. This allows shielding to be concentrated where most needed while reducing material and complexity elsewhere.
2Device complexity
If components are stacked or mounted on one side only, then device complexity is reduced, but cooling efficiency deteriorates
Solution Approach 1:
The invention transitions from single-sided or stacked component mounting to multi-sided mounting arrangement. Components are distributed across front, rear, and/or side walls of the package, utilizing three-dimensional space more effectively. This enables heat dissipation pathways in multiple directions rather than relying on a single cooling path through the package bottom.
3Ease of manufacture
If electrical connections use longer paths, then ease of manufacture is improved, but power losses increase
Solution Approach 1:
The electrical connection system is segmented into multiple independent pathways including inner leads within the package and outer leads at the periphery. This segmentation allows selection of shorter inner lead paths for critical high-current connections while using outer leads for less critical connections, optimizing the balance between manufacturing ease and power loss reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances EMI shielding, improves cooling efficiency, and reduces power losses, leading to improved performance and space utilization in power-supply modules.
Implementation Method 1
an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package
Implementation Method 2
the primary cooling path for the first component is through the package top and the primary cooling path for the second component is through the package bottom
Implementation Method 3
improved cooling of its internal components as compared to modules with stacked components or with components mounted along only one side of the package
Data Source
AI summary
An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.