Power Supply Module Stacked Passive Element Unibody Conductor
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Solution Overview
Problem
Existing power supply modules have a bloated size due to the need for process tolerance and clearance in soldering passive elements onto substrates, which limits downsizing despite efforts to improve craftsmanship.
Innovation Solution
A power supply module design featuring a substrate with a conductive layer and a passive element in a stacking manner, where a unibody conductive member penetrates through the energy storage part to connect with both the conductive part and the conductive layer, eliminating the need for leadouts and reducing assembly tolerance, enabling a compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive elements are soldered onto substrates using conventional processes, then reliable electrical connections are achieved, but the module size becomes bloated due to required process tolerance and clearance
Solution Approach 1:
The patent merges the substrate and passive element into a stacked configuration where the passive element is directly mounted on the substrate surface, eliminating the need for separate leadouts and reducing the required clearance. The conductive member integrates the electrical connection function directly at the component interface, combining multiple functions into a compact structure that resolves the contradiction between connection reliability and module size.
Solution Approach 2:
The patent transitions from a planar layout to a three-dimensional stacked architecture, arranging the substrate and passive element in vertical layers. This dimensional change allows electrical connections to be made through the thickness of the assembly rather than requiring lateral leadouts, significantly reducing the footprint and overall module volume while maintaining connection integrity.
2Manufacturing precision
If process tolerance and clearance are reserved for soldering operations, then manufacturing reliability is improved, but the footprint and module size increase
Solution Approach 1:
The substrate and passive element are merged into a tight stacked arrangement with minimal clearance requirements. The conductive member is positioned to make direct contact with both the substrate conductive layer and the passive element terminal, eliminating the need for extended leadouts and reducing the lateral footprint while maintaining manufacturing precision through controlled placement.
Solution Approach 2:
The design moves electrical connections from the lateral plane to the vertical dimension by stacking components and making through-contact connections. This reduces the required lateral footprint and clearance while maintaining connection reliability, as the vertical stacking allows tighter packing in the planar direction.
Data Source
AI summary
The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.