Power Supply Module Vertical Component Mounting
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Solution Overview
Problem
Existing power supply modules have a large footprint due to the mounting configuration of electronic components, which hinders further miniaturization and integration in compact electronic devices.
Innovation Solution
A power supply module design featuring a substrate with perpendicular surfaces, where electronic components are mounted on one surface and an inductor on the other, sealed by resin members, allowing for a smaller footprint and improved noise suppression through optimized component placement and resin shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electronic components are mounted on the top surface of a chip inductor to reduce module size, then the footprint is reduced, but the inductor and components occupy the same planar space which may cause electromagnetic interference and thermal issues
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional vertical stacking. The chip inductor is positioned on the substrate, and electronic components are mounted on the vertical sidewalls of the inductor, utilizing the Z-dimension to reduce planar footprint while maintaining spatial separation between the inductor and components, thereby reducing electromagnetic interference.
2Quantity of substance
If multiple electronic components are mounted on a single substrate surface, then integration density increases, but heat dissipation becomes more difficult
Solution Approach 1:
Components are distributed across different vertical levels and surfaces. The substrate provides a first mounting surface, while the vertical sidewalls of the chip inductor provide additional mounting surfaces at different heights. This vertical distribution improves heat dissipation by exposing components to different thermal environments and increasing surface area for heat transfer.
3Area of stationary object
If the module uses a compact vertical structure to reduce footprint, then size is reduced, but manufacturing complexity increases
Solution Approach 1:
The module is segmented into distinct functional zones: the substrate layer, the chip inductor with defined sidewalls, and the mounted electronic components. This segmentation allows for standardized manufacturing processes for each component, which are then assembled in a systematic sequence, reducing overall manufacturing complexity despite the three-dimensional structure.
Solution Approach 2:
The chip inductor serves as an intermediary structure that provides both its functional inductance and a mechanical platform for mounting components on its sidewalls. This dual-function design simplifies the overall structure by eliminating the need for separate mounting fixtures or additional support structures.
Data Source
Figure 1(A)~1(B)
Figure 2(A)~2(B)
Figure 3(A)~3(B)
AI summary
A power supply module (101) has a first outer surface (VS1) and a second outer surface (VS2) that is adjacent to the first outer surface (VS1) and perpendicular to the first outer surface (VS1). The power supply module (101) includes a substrate (1) that has a first surface (PS1) and a side surface (SS1), a plurality of electronic components (a control IC (3), a capacitor (21), switching elements (31, 32), and the like) that are mounted at least on the first surface (PS1), a first resin material (11) that is formed on the first surface (PS1), and terminal electrodes (P1, P2, P3, P4, P5, P6) that are exposed at least at the first outer surface (VS1). The first resin member (11) seals the electronic components mounted on the first surface (PS1). In the substrate (1), the first surface (PS1) is perpendicular to the first outer surface (VS1), and the first outer surface (VS1) is formed so as to extend at least across the side surface (SS1) of the substrate (1) and the first resin member (11). The area of the first outer surface (VS1) is smaller than the area of the second outer surface (VS2).