Power Supply Heat Dissipation via Conductive Packing Member
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Solution Overview
Problem
Conventional power supply unit arrangements in housings suffer from reduced heat transfer due to insufficient surface contact, leading to increased temperature and reduced lifespan, as the units vary in shape and size, and the housing inner walls are not always perfectly planar.
Innovation Solution
Incorporating a thermally conductive packing member, such as a slab or wedge, between the power supply unit and the housing inner walls to establish maximum conductive thermal contact, ensuring the unit abuts multiple walls and facilitating heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting with screws through holes is used, then the power supply unit is securely fixed in the housing, but the surface contact area is reduced leading to poor heat transfer
Solution Approach 1:
A thermally conductive packing material is introduced as an intermediary substance between the power supply unit and the housing inner wall. This packing material fills the gaps and irregularities, creating extensive thermal contact pathways while allowing the unit to remain securely fixed through the screw mounting system.
Solution Approach 2:
The thermal conductivity parameter of the interface between the power supply unit and housing is improved by introducing the thermally conductive packing material. This changes the thermal interface resistance from high to low, enabling efficient heat transfer while maintaining mechanical fixation.
2Device complexity
If the power supply unit abuts only one inner wall of the housing, then the mounting structure is simple, but the points of surface contact are reduced
Solution Approach 1:
The thermally conductive packing material serves as a mediator that enables the power supply unit to effectively contact multiple inner walls of the housing simultaneously. It fills the spaces between the unit and housing walls, creating thermal pathways without complicating the mounting structure.
3Ease of manufacture
If the housing inner wall is not perfectly planar, then manufacturing is easier, but the surface contact points between housing and power supply unit are reduced
Solution Approach 1:
The thermally conductive packing material provides local thermal conductivity enhancement at the interface regions where contact is needed. It compensates for the non-planar surface irregularities by filling gaps locally, ensuring efficient heat transfer without requiring the entire housing to be manufactured with high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances heat transfer between the power supply unit and the housing, reducing the unit's operating temperature and extending its lifespan by maximizing surface contact.
Implementation Method 1
The arrangement is configured to increase conductive thermal contact between at least some of the inner walls of the housing and the power supply unit
Data Source
AI summary
The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.