Power Supply Cooling Structure for Through-Hole Pin Heat Dissipation
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Solution Overview
Problem
Existing power supply unit cooling methods focus on reducing the temperature of internal components but neglect the heat dissipation of through-hole packaged components' exposed pins.
Innovation Solution
A power supply device design incorporating a thermally conductive glue, plate, and ventilation pipes, along with a fan module, to enhance heat dissipation by absorbing heat from pins and transferring it through forced convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ventilation openings are provided on both sides of the casing for airflow to cool internal components, then the temperature of internal components is reduced, but the heat dissipation of through-hole packaged components' exposed pins is not addressed
Solution Approach 1:
A heat dissipation component is introduced as an intermediary between the exposed pins and the external environment. This component includes a heat dissipation body in contact with the pins and a heat dissipation fin extending outward, serving as a thermal bridge to transfer heat from the pins to the surrounding air through increased surface area and forced convection.
Solution Approach 2:
The heat dissipation solution extends from the two-dimensional ventilation openings on the casing sides to a three-dimensional heat dissipation structure with fins. The fins protrude outward from the heat dissipation body, creating additional thermal exchange surfaces in the radial dimension to enhance heat dissipation capacity.
2Device complexity
If traditional ventilation cooling is used, then the cooling structure is simple, but the heat dissipation efficiency for through-hole mounted components is insufficient
Solution Approach 1:
The heat dissipation function is merged with the existing ventilation system. The heat dissipation component is integrated into the casing structure, and the fan module that drives ventilation airflow also serves to drive forced convection over the heat dissipation fins, combining two functions into a unified system.
Solution Approach 2:
The heat dissipation system utilizes forced convection driven by the fan module, transforming from passive natural convection to active dynamic cooling. The fan creates controlled airflow that dynamically interacts with the heat dissipation fins to enhance heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency for through-hole mounted components, effectively reducing their temperature.
Implementation Method 1
The thermally conductive glue is disposed under the circuit board module and is filled in the bottom of the casing
Implementation Method 2
a fan module, to enhance heat dissipation by absorbing heat from pins and transferring it through forced convection
Data Source
AI summary
A power supply device is provided. The power supply device comprises a casing, a circuit board module, thermally conductive glue, a thermally conductive plate and a plurality of ventilation pipes. The circuit board module is arranged in the casing. The thermally conductive glue is disposed under the circuit board module and is filled in the bottom of the casing. The thermally conductive plate is disposed below the circuit board module and is embedded in the thermally conductive glue. The plurality of ventilation pipes are disposed on the thermally conductive plate and are embedded in the thermally conductive glue. Each of the ventilation pipes has openings at two ends thereof.