Power Supply Device Stacked Body Segmentation
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Solution Overview
Problem
Existing power supply devices, such as those used in hybrid and electric cars, face challenges in downsizing, noise reduction, and heat dissipation efficiency due to the configuration where a transformer or choke coil is interposed between the circuit board and semiconductor components, leading to increased wire lengths and potential heat dissipation issues.
Innovation Solution
A power supply device configuration where a transformer, primary semiconductor component, secondary semiconductor component, and choke coil are paired to form stacked bodies, with the circuit board interposed between these pairs, reducing the distance between components and wire lengths, and enhancing heat dissipation by dispersing electronic components on both sides of the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the transformer or choke coil is interposed between the circuit board and semiconductor components, then the components can be arranged in stacked bodies for downsizing, but the wire lengths increase and noise increases
Solution Approach 1:
The patent divides the stacked body configuration into two separate stacked bodies: a first stacked body containing the transformer and first semiconductor component, and a second stacked body containing the choke coil and second semiconductor component. The circuit board is positioned between these two stacked bodies, segmenting the arrangement to reduce wire lengths and electromagnetic noise while maintaining the space-saving stacked configuration.
2Volume of moving object
If the transformer or choke coil is interposed between the circuit board and semiconductor components, then the components can be arranged in stacked bodies, but heat dissipation efficiency deteriorates
Solution Approach 1:
By segmenting the stacked bodies and positioning the circuit board between them, the patent creates separate thermal zones for the transformer and choke coil. This segmentation allows heat from each component to dissipate independently toward opposite sides of the circuit board, improving overall heat dissipation efficiency while maintaining the compact stacked configuration.
3Volume of moving object
If the circuit board is positioned opposite to semiconductor components with transformer or choke coil in between, then stacked body configuration is achieved, but wire lengths increase
Solution Approach 1:
The patent segments the overall structure into two stacked bodies positioned on opposite sides of the circuit board. This segmentation allows direct connections between the first semiconductor component and transformer on one side, and the second semiconductor component and choke coil on the other side, minimizing wire lengths within each stacked body while maintaining the compact overall device size.
Data Source
AI summary
A power supply device includes a transformer, a primary semiconductor component, a secondary semiconductor component, a choke coil and a circuit board. Electronic components which include the transformer, the primary semiconductor component, the secondary semiconductor component, and the choke coil, are stacked in pairs, in a normal direction of a board. One pair forms a first stacked body and another pair to forms a second stacked body. A circuit board is interposed between the one pair of electronic components which forms the first stacked body, and also between the other pair of electronic components which forms the second stacked body.