Compact Power-Supply Apparatus Stacking Transformer and Semiconductor Units
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power-supply apparatuses for hybrid and electric vehicles are large due to numerous electronic components, leading to increased wire length and electric resistance, which results in energy loss and electromagnetic noise.
Innovation Solution
A compact power-supply apparatus design where a transformer and semiconductor units are stacked to overlap each other, reducing the overall size and electromagnetic noise by minimizing the distance between components and using conductors as electromagnetic shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic parts are arranged on a wiring board on a base plate, then the power-supply apparatus can be assembled with conventional mounting methods, but the overall size of the power-supply apparatus increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of electronic parts on a wiring board to a three-dimensional stacked configuration where the wiring board is positioned above the base plate. This vertical stacking allows components to occupy different spatial layers, reducing the footprint area while maintaining all necessary electrical connections through vertically oriented conductors.
Solution Approach 2:
The invention nests the wiring board structure within the overall apparatus by positioning it vertically above the base plate rather than expanding horizontally. The conductor connections are nested within the vertical space between the base plate and wiring board, effectively utilizing the third dimension to accommodate all components and connections without increasing the horizontal footprint.
2Ease of operation
If electronic parts are placed on the same level horizontally, then they can be mounted on a single plane, but the interval between adjacent parts increases the overall length of connecting wires
Solution Approach 1:
The patent moves the wiring board to a different vertical level above the base plate, transforming the horizontal wire routing into a predominantly vertical configuration. This dimensional change allows conductors to connect components through the vertical space between layers rather than traversing long horizontal paths, significantly reducing the overall wire length required.
3Ease of operation
If wire length increases to connect horizontally placed electronic parts, then all parts can be connected on a single plane, but electric resistance increases causing energy loss
Solution Approach 1:
By positioning the wiring board vertically above the base plate, the patent creates short vertical conductor paths that minimize resistance. The vertical stacking configuration ensures that connecting wires traverse minimal distance between components, reducing I²R losses and improving overall energy efficiency compared to horizontal arrangements requiring long wire runs.
4Ease of operation
If wire length increases to connect horizontally placed electronic parts, then all parts can be connected on a single plane, but loop area increases thereby increasing electromagnetic noise
Solution Approach 1:
The vertical stacking configuration compresses the current loops into the vertical dimension between the base plate and wiring board. This creates tightly coupled return paths with minimal loop area, effectively reducing electromagnetic radiation and noise compared to horizontal arrangements where current loops spread out across large planar areas.
5Area of stationary object
If electronic parts are arranged to reduce size, then the overall footprint decreases, but the distance between parts increases leading to longer wires
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension to position the wiring board above the base plate. This allows components to be densely packed in the horizontal footprint while maintaining short connection distances through the vertical stacking arrangement, effectively decoupling footprint reduction from wire length increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the size of the power-supply apparatus, decreases energy loss, and minimizes electromagnetic noise, enhancing operational efficiency and reducing the impact on peripheral devices.
Implementation Method 1
a transformer (2) equipped with a primary coil (22) and two secondary coils (23)
Implementation Method 2
a primary semiconductor module (3) having a plurality of built-in switching devices (31), a secondary semiconductor module (41) having built-in rectifying devices (411)
Implementation Method 3
a choke coil (43)
Data Source
AI summary
A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.