Power Supply PCB Thermal Layout for Heat-Sensitive Components

Solution Overview

Problem

Conventional power conversion devices in LED light fixtures suffer from reduced service life of heat-sensitive components due to high temperatures generated by heat-generating electronic components, leading to potential electrolyte depletion and explosion risks.

Innovation Solution

A power supply device with a thermal insulation function that isolates heat-sensitive components from heat-generating components on a circuit board using a defined thermal insulation area and minimum distance, preventing thermal conduction and convection effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If heat-sensitive components and heat-generating electronic components are disposed on the same circuit board, then device complexity is reduced, but the service life of heat-sensitive components deteriorates due to high temperature exposure

Engineering Contradiction:

Improvecircuit board layoutVSAvoidservice life of heat-sensitive components

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The circuit board is divided into distinct thermal zones: a first circuit board region housing heat-generating electronic components and a second circuit board region housing heat-sensitive components. This spatial segmentation prevents thermal interference while maintaining integration on a single board, thus reducing overall device complexity while preserving component reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board are assigned different thermal characteristics. The first region is designed to tolerate and dissipate heat, while the second region is designed to minimize heat exposure. This local differentiation allows the board to simultaneously support both heat-generating and heat-sensitive components without compromising service life.

Inventive Principle:

Principle #3Local quality

2Area of stationary object

If heat-sensitive components are placed close to heat-generating electronic components, then area utilization is improved, but temperature exposure increases causing electrolyte depletion and potential explosion

Engineering Contradiction:

Improvecircuit board area utilizationVSAvoidtemperature exposure to heat-sensitive components

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The circuit board is divided into distinct thermal zones: a first circuit board region housing heat-generating electronic components and a second circuit board region housing heat-sensitive components. This spatial segmentation prevents thermal interference while maintaining integration on a single board, thus reducing overall device complexity while preserving component reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation structures are positioned between heat-generating and heat-sensitive components to act as thermal intermediaries. These structures manage heat flow, preventing direct thermal coupling while allowing both components to coexist on the same circuit board with optimized area utilization.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If heat-generating electronic components operate at high power, then productivity is improved, but heat-sensitive components suffer from accelerated electrolyte depletion and reduced endurance

Engineering Contradiction:

Improvepower output of electronic componentsVSAvoidendurance of heat-sensitive components

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The circuit board is divided into distinct thermal zones: a first circuit board region housing heat-generating electronic components and a second circuit board region housing heat-sensitive components. This spatial segmentation prevents thermal interference while maintaining integration on a single board, thus reducing overall device complexity while preserving component reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation structures are positioned between heat-generating and heat-sensitive components to act as thermal intermediaries. These structures manage heat flow, preventing direct thermal coupling while allowing both components to coexist on the same circuit board with optimized area utilization.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal insulation effectively protects heat-sensitive components from high temperatures, enhancing their service life and performance by separating them from heat sources, thereby maintaining operational reliability.

Implementation Method 1

preventing thermal conduction and convection effects

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

preventing thermal conduction and convection effects

Methodology Applied

Scientific EffectThermal convection: Convection

Implementation Method 3

a thermal insulation area is defined between the at least one heat-sensitive component and the heat-generating electronic components

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20260022830A1Power supply device

Publication Date: 2026.01.22 ELEMENTS PERFORMANCE MATERIALS

AI summary

A power supply device having a thermal insulation function includes a circuit board, and at least one heat-sensitive component and a plurality of heat-generating electronic components that are disposed on the circuit board and spaced apart from one another. A minimum distance between the heat-sensitive component and the heat-generating electronic components is 7 mm. A thermal insulation area is defined between the heat-sensitive component and the heat-generating electronic components, and none of the heat-generating electronic components is disposed within a 270° range of the thermal insulation area. The heat-generating electronic components are disposed outside the thermal insulation area to separate the heat-sensitive component from a heat source on the circuit board, such that a high temperature of the heat source has less influence on the heat-sensitive component.