Power Supply System Vertical Stacking for Processor Impedance
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Solution Overview
Problem
The existing power supply systems for processor chips face performance issues due to high connection impedance between the power unit and the processor chip, leading to poor power supply performance.
Innovation Solution
A power supply system is designed with a system board and substrate configuration that includes surface-mounted output capacitors and conductive-connected regions, reducing connection impedance by positioning the load and power units to minimize electrical pathways and enhance current flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power unit and processor chip are connected through conventional wiring, then the system is easy to manufacture, but the connection impedance is high which degrades power supply performance
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional vertical stacking, placing the power unit directly beneath the processor chip on the same substrate. This dimensional change creates direct vertical electrical connections through via holes, eliminating long horizontal wiring paths and dramatically reducing connection impedance while maintaining manufacturability through standard semiconductor fabrication processes
Solution Approach 2:
The patent embeds the power unit within the substrate structure, nesting it directly under the processor chip. The power unit's electrical connections are integrated into the substrate's internal wiring layers, with output terminals positioned to align vertically with the processor chip's power pads, creating a compact nested configuration that reduces external connection requirements
2Reliability
If the connection path between power unit and load is lengthened for easier routing, then manufacturing is easier, but the connection impedance increases reducing power supply quality
Solution Approach 1:
The patent replaces long horizontal wiring paths with short vertical connections by stacking the power unit directly beneath the processor chip. The electrical connection path transitions from extended planar routing to compact vertical via holes through the substrate, dramatically reducing the connection path length and associated impedance while improving power supply quality
Solution Approach 2:
The patent merges the power unit and processor chip into a single integrated substrate structure, eliminating separate connection components and external wiring. The power unit's output terminals are positioned to align directly with the processor chip's power pads, merging the power delivery path into the substrate's internal wiring system and minimizing connection length
Data Source
AI summary
The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.