Power Switch Cooling Assembly With Leak-Isolated Fin Passage
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Solution Overview
Problem
Existing automotive cooling systems for power switches face challenges in efficiently dissipating heat while minimizing coolant leaks and reducing production and maintenance costs, particularly when using multiple active heat sinks.
Innovation Solution
A combination of active and passive cooling systems is employed, where a passive heat sink is integrated with an active heat sink to dissipate heat from power switches, utilizing a fin system and a base plate connection via sintering or epoxy attachment, with a sealing mechanism to isolate the power switch from the coolant flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple active heat sinks are used to dissipate heat from power switches, then thermal dissipation efficiency is improved, but the risk of coolant leaks and production/maintenance costs increase
Solution Approach 1:
The patent combines active cooling (with coolant flow) and passive cooling (without coolant) into a single integrated heat sink assembly. The passive heat sink portion provides alternative heat dissipation pathways that do not require coolant, thereby reducing leak risks while maintaining thermal efficiency. The active heat sink portion continues to provide high-performance cooling where needed.
Solution Approach 2:
The heat sink is divided into distinct active and passive cooling zones. The passive heat sink includes fins and heat dissipation surfaces that operate independently from the coolant system, while the active heat sink contains coolant channels. This segmentation allows each portion to optimize its cooling mechanism without compromising the other.
2Temperature
If multiple active heat sinks are used to dissipate heat from power switches, then thermal dissipation efficiency is improved, but production and maintenance costs increase
Solution Approach 1:
By merging active and passive cooling into a single integrated structure, the patent reduces the total number of separate components that need to be manufactured, assembled, and maintained. The passive heat sink can be formed as an integral part of the heat sink assembly, eliminating the need for separate passive cooling components and reducing assembly steps.
Solution Approach 2:
The heat sink assembly serves multiple cooling functions simultaneously - active coolant-based cooling and passive convection/radiation cooling - within a single unified structure. This multi-functionality eliminates the need for separate active and passive heat sink components, reducing manufacturing complexity and maintenance requirements.
3Reliability
If a sealing mechanism is added to isolate the power switch from coolant flow, then reliability is improved, but device complexity increases
Solution Approach 1:
The sealing function is merged with the structural components of the heat sink assembly. The housing and mounting structures simultaneously provide mechanical support and sealing functions, eliminating the need for separate sealing components. The single-seal design integrates sealing into the basic structure rather than adding it as an extra layer of complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of coolant leaks, decreases production and maintenance costs, and enhances thermal dissipation efficiency by distributing heat through both active and passive means, providing structural support and design flexibility.
Implementation Method 1
dissipating at least a portion of the heat dissipated to the fin system to a coolant flowing through the plurality of fins of the fin system
Implementation Method 2
dissipating at least a portion of the heat generated at the power switch to a coolant flowing through the plurality of fins of the fin system
Implementation Method 3
the base plate is connected to the exterior surface of the power switch via sintering to sealingly isolate the power switch from the plurality of fins
Implementation Method 4
a first heat dissipation element, wherein the first heat dissipation element faces a first surface of the power switch
Implementation Method 5
the first heat dissipation element is one of an active heat sink or a passive heat sink
Data Source
AI summary
A power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.