Power Switch Cooling Layout With Single Active Heat Sink

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Solution Overview

Problem

Existing automotive cooling systems for power switches often rely on heat sinks with fluid-based active cooling, which can lead to coolant leaks and increased production and maintenance costs, while passive cooling structures lack design flexibility.

Innovation Solution

A combination of passive and active cooling systems, where a passive heat dissipation element thermally conducts heat to an active heat dissipation element, eliminating the need for a second active heat sink and reducing leak risks, with the passive element being enclosure-free and providing structural support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fluid-based active cooling systems are used for power switches, then cooling efficiency is improved, but the risk of coolant leaks and maintenance costs increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcoolant leak risk

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The cooling system is divided into two separate elements: a passive heat dissipation element that contacts one surface of the power switch and an active heat dissipation element that contacts the opposite surface. This segmentation allows the active cooling component to be minimized to a single element, reducing leak risks while maintaining cooling efficiency through the passive element's extended heat dissipation surface.

Inventive Principle:

Principle #1Segmentation

2Temperature

If multiple active heat sinks are used on both sides of power switches, then cooling performance is improved, but production costs and system complexity increase

Engineering Contradiction:

Improvecooling performanceVSAvoidsystem complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The passive heat dissipation element and active heat dissipation element are thermally coupled through the power switch, creating a unified cooling system. The passive element extends the heat dissipation surface area while the single active element provides the necessary cooling, merging the functions of what would traditionally require multiple active heat sinks into a simpler two-element system.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If passive cooling structures are used, then leak risks are reduced, but design flexibility and cooling efficiency are limited

Engineering Contradiction:

Improveleak risk reductionVSAvoiddesign flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The passive heat dissipation element serves multiple functions: it extends the heat dissipation surface area, provides structural support, and thermally couples the power switch to the active heat dissipation element. This multi-functionality allows the passive element to contribute actively to cooling efficiency while maintaining its inherent reliability advantage of having no coolant containment.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Temperature

If traditional heat sinks with fluid-based cooling are used, then cooling effectiveness is improved, but production and maintenance costs increase

Engineering Contradiction:

Improvecooling effectivenessVSAvoidproduction cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The passive heat dissipation element is designed as a simple, low-cost component that can be easily manufactured and replaced if necessary. By using a passive element instead of a second active heat sink with coolant channels, the system reduces production costs while maintaining cooling effectiveness through the thermal coupling of the two elements.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances cooling efficiency, reduces production and maintenance costs, and minimizes coolant leaks by utilizing a single active heat sink, while offering design flexibility and improved thermal conductivity.

Implementation Method 1

a passive heat dissipation element in contact with and facing a first surface of the one or more power switches... in thermal contact with the passive heat dissipation element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Heat sinks provide effective means of dissipating heat by thermally conducting heat into a fluid medium

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250279733A1Systems and methods for active and passive cooling of electrical components

Publication Date: 2025.09.04 BORGWARNER US TECHNOLOGIES LLC

AI summary

A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.