Power Switch Packaging with Pre-Formed Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor packaging, the existing surface-mount technology (SMT) leads to longer connection paths between integrated circuits (ICs) and inductors on printed circuit boards (PCBs), resulting in increased noise and parasitic capacitance due to the separate attachment of ICs and inductors as modules, which affects the performance of power converters.
Innovation Solution
The solution involves stacking the inductor on top of the IC within a first insulating layer, with a conductive path inside a second insulating layer that interfaces with the first, thereby shortening the connection and isolating it from the PCB, reducing noise and parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If IC and inductor are attached separately as modules on PCB using surface-mount technology, then ease of manufacture is improved, but connection path length increases leading to increased noise and parasitic capacitance
Solution Approach 1:
The patent merges the IC and inductor into a single integrated power converter package, eliminating their separate module status. The inductor is positioned directly on top of the IC package, and the conductive path is formed within the insulating layer to create a unified structure that reduces connection path length and minimizes noise and parasitic capacitance while maintaining ease of manufacture as a single unit.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional stacked configuration. The inductor is placed vertically on top of the IC package rather than being mounted separately on the PCB plane, creating a shorter connection path through the vertical dimension. This dimensional change reduces the horizontal distance between components while maintaining ease of manufacture through standardized packaging.
2Ease of operation
If IC and inductor are connected through PCB traces, then ease of assembly is improved, but connection path length increases affecting power converter performance
Solution Approach 1:
The patent combines the IC and inductor into a single integrated package with internal connections, eliminating the need for separate PCB trace connections. The conductive path is formed within the insulating layer during package fabrication, creating a direct electrical connection that is shorter than PCB traces while maintaining ease of assembly as a pre-integrated unit.
Solution Approach 2:
The insulating layer serves as an intermediary medium that contains the conductive path between the IC and inductor. Rather than using PCB traces as the connection medium, the conductive path embedded in the insulating layer provides a direct, controlled connection that reduces path length while the insulating layer maintains electrical isolation and structural integrity.
3Adaptability or versatility
If separate modules are used for IC and inductor, then device modularity is improved, but parasitic capacitance increases due to longer connection paths
Solution Approach 1:
The patent merges the IC and inductor into a single integrated power converter package, eliminating the separate module configuration. This integration reduces the connection path length between the components, thereby reducing parasitic capacitance generated by the connection paths while maintaining the power converter as a modular unit that can be easily replaced or upgraded.
Solution Approach 2:
The patent uses vertical stacking in the third dimension to reduce the horizontal distance between IC and inductor. By placing the inductor directly on top of the IC package and creating a vertical connection path through the insulating layer, the design reduces parasitic capacitance compared to horizontal PCB mounting while preserving modular functionality.
Data Source
AI summary
In some examples, device includes an integrated circuit (IC) inside a first insulating layer, an inductor, and a second insulating layer arranged between the first insulating layer and the inductor. The first insulating layer shares an interface with the second insulating layer, and the inductor is attached to the second insulating layer. The device further includes a conductive path configured to conduct electricity between the IC and the inductor, wherein the conductive path is inside the second insulating layer.