Power Tap Cell Layout With Backside Vias for Stable Voltage
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Solution Overview
Problem
The increasing complexity and demand for high reliability and multi-functionality in semiconductor devices pose challenges in designing efficient power delivery networks that maintain optimal voltage distribution and reduce area occupancy.
Innovation Solution
The semiconductor device incorporates a substrate with power tap cells and power rails, featuring power through vias that connect the power delivery network to the power rails, allowing for efficient voltage distribution and reduced area usage by optimizing the height and expansion of power tap cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power tap cells are designed with sufficient height and expansion to ensure stable voltage supply, then reliability is improved, but area occupancy increases
Solution Approach 1:
The patent utilizes the vertical dimension by implementing power through vias that extend from the first side to the second side of the substrate, enabling three-dimensional power distribution. This allows the power delivery network to access power rails without requiring additional lateral space, thus improving voltage supply stability while minimizing area occupancy.
Solution Approach 2:
The power through vias are positioned to overlap with the power rails in the vertical direction, creating a nested configuration where the via structure is vertically aligned with and connected to the expansion parts of the power rails. This nesting arrangement maximizes space utilization and ensures stable electrical connection without increasing footprint area.
2Reliability
If power rails are extended and expanded to improve voltage distribution, then power delivery performance is improved, but device area increases
Solution Approach 1:
The power rails are designed with expansion parts that extend in the first direction (lateral) and are connected to power through vias that access power from the second direction (vertical). This multi-dimensional power rail configuration improves voltage distribution by providing multiple access points without proportionally increasing the overall device area.
Solution Approach 2:
The power rails include expansion parts with different widths at different locations - narrower in the first direction and wider in the second direction where they connect to power through vias. This local variation in dimensions optimizes the balance between voltage distribution capability and area efficiency, providing enhanced connection areas only where needed.
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a substrate including a first side and a second side that are opposite to each other, a power tap cell in a first row, a second row adjacent to the first row, and a third row adjacent to the second row, on the first side of the substrate, a first power rail and a second power rail on the power tap cell, that extend in a first direction and are spaced apart from each other in a second direction, and a power delivery network on the second side of the substrate. The power tap cell includes a first power through via that penetrates the substrate and extends from the power delivery network to the first power rail, and a second power through via that penetrates the substrate and extends from the power delivery network to the second power rail.