Power Tap-Off Connector for High Power Computing Systems
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Solution Overview
Problem
High-power computing systems face challenges in efficiently distributing high currents without increasing current density in printed circuit boards (PCBs), which limits the ability to upgrade or design for future power requirements, leading to thicker, more costly PCBs with increased manufacturing complexity.
Innovation Solution
The implementation of a power tap-off connector system that allows current to be split between the PCB and a conductive interconnect like a busbar, reducing current density on the PCB and enabling higher power handling without additional power planes, using terminals with unique cross-sectional shapes for secure and efficient connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current is distributed through PCB power planes, then power transmission capability is improved, but PCB thickness and manufacturing complexity increase
Solution Approach 1:
The power distribution function is segmented between the PCB and an external conductive interconnect (busbar). The PCB handles only a portion of the power distribution, while the busbar carries the high-current path separately. This segmentation allows the PCB to maintain standard thickness and complexity while achieving high power transmission capability through the combined system.
2Power
If PCB thickness is increased to handle higher current density, then power handling capability is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The high-current carrying function is extracted from the PCB and placed in a separate conductive interconnect (busbar). This extraction allows the PCB to remain thin and easy to manufacture, while the busbar—optimized for high current carrying—handles the power distribution externally. The terminal structure facilitates this separation by providing both PCB mounting capability and busbar connection capability.
3Adaptability or versatility
If multiple power planes are added to PCB for future upgrades, then adaptability is improved, but device complexity and cost increase
Solution Approach 1:
The terminal structure is designed with multi-functionality to support both current PCB connections and future busbar interconnect configurations. The terminal includes both PCB mounting features (first set of contact pads) and busbar connection features (second set of contact pads with openings), allowing the same component to adapt to different power distribution architectures and support future system upgrades without increasing PCB complexity.
Data Source
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AI summary
A connector that enables electronic assemblies to be efficiently configured for any of multiple power requirements. The connector may have a mating interface, which may mate with a power supply, a mounting interface for attaching the connector to a PCB and a power tap off interface. The power tap off interface enables distribution of a portion of the power received through the mating interface to remote locations on the PCB. Terminals with portions at each of the mating interface, mounting interface and power tap off interface may be formed from subassemblies, with conductors of one terminal subassembly engaging conductors of another subassembly. One subassembly may have conductors with mating contact portions at one end and a body portion with holes at the other end. Another subassembly may have conductors with tails passing through and engaging the holes in the body portion of the other.