Power Supply Terminal Assembly Stray Inductance Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current semiconductor devices experience high stray inductance due to the coplanar arrangement of power supply terminals, which leads to increased magnetic field interference and reduced efficiency.

Innovation Solution

The power supply terminals are arranged in parallel within a power terminal assembly, utilizing a monolithic frame with an isolation and retention portion to align them orthogonally, reducing magnetic field overlap and stray inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If power supply terminals are arranged coplanar in traditional semiconductor devices, then the device structure is simple and easy to manufacture, but stray inductance increases and magnetic field interference worsens

Engineering Contradiction:
Improveease of manufactureVSAvoidstray inductance
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a coplanar (2D) arrangement of power supply terminals to a three-dimensional configuration where terminals are positioned at different heights and locations. Specifically, the first power supply terminal is positioned at a first location and the second power supply terminal is positioned at a second location that is offset both laterally and vertically, creating a spatial separation that reduces magnetic field coupling and stray inductance while maintaining manufacturing feasibility through standardized packaging processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If power supply terminals are arranged coplanar, then manufacturing is easier, but magnetic field interference increases

Engineering Contradiction:
Improveease of manufactureVSAvoidmagnetic field interference
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The invention introduces vertical dimensionality to the terminal arrangement, positioning terminals at different z-heights within the package. This spatial separation in three dimensions reduces the overlap of magnetic field lines generated by current flow in the terminals, thereby minimizing magnetic field interference and electromagnetic interference (EMI) while still using conventional manufacturing techniques.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If power supply terminals are arranged in parallel with isolation portion, then stray inductance is reduced, but device complexity increases

Engineering Contradiction:
Improvestray inductanceVSAvoiddevice complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent introduces an isolation portion as an intermediary element positioned between the first and second power supply terminals. This isolation portion, which can be an insulating structure or spacing element, electrically isolates the terminals from each other and provides mechanical support for maintaining the precise three-dimensional positioning. This mediator enables the low-stray-inductance configuration while managing the increased structural complexity through a dedicated isolation component.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP3370332B1Stray inductance reduction in packaged semiconductor devices and modules
Publication Date: 2020.10.28 SEMICON COMPONENTS IND LLC
  • EP3370332B1 patent drawingFigure 1
  • EP3370332B1 patent drawingFigure 2A~2B
  • EP3370332B1 patent drawingFigure 3A~3D

AI summary

In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.