Power Electronic Transformer Layout for Cooling and Insulation
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Solution Overview
Problem
Traditional transformers are limited in providing multi-stage voltage adjustment, AC-DC conversion, and intelligent energy management functions required for modern distributed power generation and energy storage systems connected to the power grid.
Innovation Solution
A power electronic transformer structure with a high-frequency transformer, high-voltage and low-voltage side modules, and a support made of epoxy material, featuring a ring-shaped design with series and parallel cooling circuits and copper-clad aluminum buses for efficient cooling and insulation, along with deionized water systems for cooling and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional transformer structure is used, then the structure is simple and easy to manufacture, but it cannot provide multi-stage voltage adjustment, AC-DC conversion, and intelligent energy management functions
Solution Approach 1:
The patent merges the transformer core with power electronic modules (rectifiers, inverters, controllers) into an integrated power electronic transformer structure. The high-voltage and low-voltage side modules are directly mounted on the transformer tank, eliminating the need for separate devices and enabling multiple functions (voltage adjustment, AC-DC conversion, energy management) within a single unified structure.
Solution Approach 2:
The power electronic transformer structure is designed to perform multiple functions simultaneously: voltage transformation, multi-stage voltage adjustment, AC-DC conversion, and intelligent energy management. The high-voltage side modules and low-voltage side modules work together with the transformer to provide these diverse functions, making the device universally applicable to various power grid connection scenarios.
2Adaptability or versatility
If power electronic modules are added to provide required functions, then functional versatility is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple power electronic modules (high-voltage rectifier module, high-voltage inverter module, low-voltage rectifier module, low-voltage inverter module, and controller) into a single integrated assembly mounted on the transformer tank. This merging approach reduces the number of separate manufacturing processes and simplifies assembly compared to using entirely separate devices.
Solution Approach 2:
The power electronic transformer is divided into functional modules (high-voltage side modules, low-voltage side modules, cooling circuits) that can be manufactured and tested independently before final assembly. This segmentation allows for specialized manufacturing of each module while maintaining overall system integration, balancing manufacturing complexity with functional versatility.
3Volume of moving object
If a compact integrated structure is used, then space efficiency is improved, but insulation reliability and cooling efficiency become more difficult to ensure
Solution Approach 1:
The patent applies different insulation materials and cooling circuit configurations to different regions of the transformer based on local requirements. The high-voltage and low-voltage sides have separate cooling circuits and insulation arrangements tailored to their specific electrical and thermal characteristics, ensuring reliable insulation and effective cooling in each local area while maintaining compact overall dimensions.
Solution Approach 2:
The transformer tank serves as a common equipotential reference for all power electronic modules mounted on it. By providing a unified grounding and shielding structure, the patent ensures electrical insulation reliability between high-voltage and low-voltage components while maintaining compact integration, preventing electrical interference and ensuring safe operation.
4Volume of moving object
If a compact integrated structure is used, then space efficiency is improved, but cooling efficiency becomes more difficult to ensure
Solution Approach 1:
The cooling system is segmented into separate high-voltage side cooling circuits and low-voltage side cooling circuits, with independent cooling paths for different power electronic modules. This segmentation allows each module to be cooled according to its specific thermal characteristics and power dissipation requirements, maintaining high cooling efficiency in the compact integrated structure.
Solution Approach 2:
Different cooling circuit configurations are applied to different regions of the transformer based on local heat generation and thermal requirements. The patent optimizes cooling flow paths and heat dissipation structures in high-heat areas while maintaining compact overall dimensions, ensuring effective temperature control throughout the integrated device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, efficient, and innovative transformer structure capable of multi-stage voltage adjustment and AC-DC conversion, ensuring reliable insulation and reduced maintenance, while minimizing water leakage and seepage, and facilitating integration with both AC and DC power grids.
Implementation Method 1
cooling circuits of high-voltage side modules and a low-voltage side module, and a high-frequency transformer... The support and the base are made of an epoxy material
Implementation Method 2
The support and the base are made of an epoxy material... By reasonably designing the load support and insulation grids of the transformer structure
Implementation Method 3
copper-clad aluminum buses for efficient cooling and insulation
Data Source
AI summary
A power electronic transformer structure includes: a support, a high-frequency transformer, a base, high-voltage side modules, and a low-voltage side module. The high-voltage side modules are respectively located at the front, top, and back of the support; the low-voltage side module is located at the bottom of the support; the high-frequency transformer is located at the middle of the support.