Power Unit Frame with Protrusions for Heat Sink Adhesion
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Solution Overview
Problem
Existing power unit housing designs that screw onto heat sinks impair cooling by requiring threaded holes, limiting the number and spacing of cooling fins, which can disrupt optimal airflow.
Innovation Solution
A frame that surrounds the power unit and control unit, with protruding pieces for alignment and adhesive fixation to the heat sink, allowing for improved cooling and reduced size without the need for threaded holes in the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a housing is screwed to a heat sink using threaded holes, then the power unit is securely attached, but the cooling efficiency is impaired and the number of cooling fins is limited
Solution Approach 1:
The patent merges the attachment function and alignment function into a single integrated frame structure. The frame combines adhesive attachment to the heat sink with built-in alignment features (protrusions fitting into recesses) and control unit centering (second protrusions fitting into control unit recesses), eliminating the need for separate threaded holes and housing components.
Solution Approach 2:
The invention extracts and eliminates the threaded hole requirement from the heat sink by using adhesive attachment on the frame instead. This removes the constraint that limited cooling fin design, allowing the heat sink to be optimized purely for thermal performance without structural attachment holes.
2Reliability
If a frame with separate fixing and alignment functions is used, then the power unit and control board are securely mounted, but the device complexity increases
Solution Approach 1:
The patent merges multiple functions (attachment to heat sink, alignment with heat sink, and centering of control unit) into a single integrated frame structure. The frame simultaneously provides adhesive attachment surfaces, alignment protrusions, and control unit centering features, eliminating the need for separate fixing and alignment components.
Solution Approach 2:
The frame serves multiple functions simultaneously: it attaches the power unit to the heat sink via adhesive, provides alignment through protrusions fitting into heat sink recesses, and centers the control unit through second protrusions fitting into control unit recesses. This multi-functionality reduces the overall number of components needed.
3Reliability
If a housing is used to enclose the power unit, then the components are protected, but the structure becomes more complex and material usage increases
Solution Approach 1:
The invention extracts and eliminates the separate housing component by integrating the enclosure function directly into the frame structure. The frame itself serves as both the mounting structure and the protective enclosure, removing the need for additional housing parts and reducing overall structural complexity.
Solution Approach 2:
The patent merges the protective enclosure function with the mounting frame into a single integrated structure. The frame simultaneously provides mechanical support, component protection, adhesive attachment, and alignment features, eliminating the need for separate housing components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the structure, enhances cooling efficiency, and reduces material usage while ensuring secure attachment and alignment of components, allowing for uniform and sufficient cooling with minimal material and assembly complexity.
Implementation Method 1
the frame is fixed to the heat sink by means of adhesive
Implementation Method 2
at least one heat sink, at least one power unit, wherein the power unit comprises at least one semiconductor component
Implementation Method 3
the spacing between the cooling fins, which would ensure optimal airflow
Data Source
Figure 1
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AI summary
The invention relates to an apparatus (1) for enclosing a power unit (11), which is at least partially inside and/or on a heat sink (8), and for centring a control unit (20) with respect to the power unit (11), the power unit (11) comprising at least one semiconductor component (6) and a substrate (7), said apparatus comprising: a frame (2), the frame (2) at least partially, preferably completely, surrounding the substrate (7); at least one protruding piece of a first type (3), said protruding piece of the first type (3) being designed to engage in a recess or an opening (12) in a heat sink (8); at least one protruding piece of a second type (4), the protruding piece of the second type (4) being designed to engage in a recess or an opening (21) in a control unit (20) comprising at least one electronic component (24).