Poly(phenylene ether) Copolymer Solutions for Printed Circuit Board Varnishes

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Solution Overview

Problem

Thermoset resins are brittle and require improvement in toughness while maintaining their properties, and existing poly(phenylene ether) solutions in non-halogenated solvents face issues with phase separation and precipitation at room temperature, which affects their usability in varnishes for printed circuit boards.

Innovation Solution

A poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol, combined with a non-halogenated solvent, is used to create stable, concentrated solutions with reduced viscosity, resistant to phase separation and precipitation, and suitable for use in varnishes for printed circuit boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If poly(phenylene ether) is dissolved in non-halogenated solvents at room temperature, then the solution provides improved toughness and dielectric properties, but phase separation and precipitation occur reducing solution stability

Engineering Contradiction:

ImprovetoughnessVSAvoidsolution stability

Core Design Contradiction:

StrengthVSStability of the object's composition

Solution Approach 1:

The patent applies parameter changes by modifying the polymer structure through copolymerization with specific monomers (2,6-dimethylphenol and 2-methyl-6-phenylphenol) to alter solubility parameters. This enables the poly(phenylene ether) to form stable solutions in non-halogenated solvents at room temperature without phase separation, while maintaining the desired toughness properties.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite polymer system by copolymerizing multiple monomers to produce a poly(phenylene ether) copolymer with enhanced solubility characteristics. This composite material approach allows the polymer to maintain toughness while achieving compatibility with non-halogenated solvents, resolving the phase separation issue.

Inventive Principle:

Principle #40Composite materials

2Quantity of substance

If concentrated solutions of poly(phenylene ether) are prepared to maximize polymer content, then the amount of solvent is minimized, but the solutions form precipitates when exposed to freezing and sub-freezing temperatures

Engineering Contradiction:

Improvepolymer concentrationVSAvoidtemperature resistance

Core Design Contradiction:

Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The patent modifies the polymer's chemical structure through copolymerization to change its solubility and crystallization behavior. The specific copolymer composition enables concentrated solutions to remain stable across a wide temperature range including freezing conditions, preventing precipitation while maintaining high polymer content.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses non-halogenated solvents as disposable solvents that can be easily removed after processing. The modified poly(phenylene ether) copolymer allows these solvents to be used in concentrated formulations without causing freezing temperature precipitation, enabling practical transportation and handling.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Stability of the object's composition

If elevated temperatures are used to promote dissolution of poly(phenylene ether) in non-halogenated solvents, then solubility is improved, but solvent flammability and emissions increase along with energy costs

Engineering Contradiction:

ImprovesolubilityVSAvoidsolvent flammability

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent fundamentally changes the polymer's solubility parameters through copolymerization with 2,6-dimethylphenol and 2-methyl-6-phenylphenol. This structural modification enables the poly(phenylene ether) to dissolve in non-halogenated solvents at room temperature, eliminating the need for elevated temperature processing and thereby reducing flammability risks, emissions, and energy consumption.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentEP3612582B1Poly(phenylene ether) copolymer compositions and associated methods and articles

Publication Date: 2022.11.16 SHPP GLOBAL TECH BV

AI summary

A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.