PPE Resin Composition for PCB Copper Peel and Bonding Strength
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Solution Overview
Problem
Existing resin compositions fail to meet the performance requirements for high-performance circuit boards, particularly in multi-layered, high-density wiring, and high-speed signal transmission applications, necessitating improved resin compositions for laminates and circuit substrates.
Innovation Solution
A resin composition comprising 100 parts by weight of vinyl-containing polyphenylene ether resin, 8 to 20 parts by weight of a specific compound, and 0.5 to 2.5 parts by weight of another compound, which enhances copper foil peel strength, interlayer bonding strength, and thermal expansion characteristics, suitable for manufacturing prepregs, resin films, laminates, and printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If existing resin compositions are used for laminate manufacturing, then production cost and process simplicity are maintained, but copper foil peel strength and interlayer bonding strength are insufficient for high-performance circuit boards
Solution Approach 1:
The patent employs composite materials by combining vinyl-containing polyphenylene ether resin with specific compounds (formula 1 and formula 2) to create a resin composition that achieves superior copper foil peel strength and interlayer bonding strength. This composite approach allows the material to meet high-performance circuit board requirements while maintaining practical manufacturing feasibility.
Solution Approach 2:
The patent applies parameter changes by precisely controlling the weight ratios of components in the resin composition (8-20 parts by weight of compound 1 and 0.5-2.5 parts by weight of compound 2 per 100 parts of vinyl-containing polyphenylene ether resin). This quantitative optimization of composition parameters achieves the desired strength improvements without excessive complexity.
2Strength
If existing resin compositions are used, then manufacturing process simplicity is maintained, but interlayer bonding strength and thermal expansion control are insufficient
Solution Approach 1:
The patent optimizes manufacturing ease through parameter changes by defining specific weight ratio ranges for each component in the resin composition. These controlled parameters ensure consistent interlayer bonding strength and thermal expansion properties while maintaining a relatively simple manufacturing process suitable for industrial production.
Solution Approach 2:
The patent applies local quality by enhancing specific properties (interlayer bonding strength and thermal expansion control) through the addition of compounds with particular functional groups, while keeping the overall resin composition and manufacturing process relatively simple. The specific compounds provide localized functional improvements where needed.
3Reliability
If high-performance resin compositions are developed to meet multi-layered and high-density wiring requirements, then circuit board performance is improved, but resin composition complexity increases
Solution Approach 1:
The patent uses composite materials to achieve high circuit board performance for multi-layered and high-density wiring applications. By combining vinyl-containing polyphenylene ether resin with specifically formulated compounds, the resin composition delivers the reliability needed for advanced circuit boards while managing composition complexity through defined component ratios.
Solution Approach 2:
The patent manages composition complexity through parameter changes by establishing specific weight ratio ranges for each component. This quantitative approach ensures the resin composition meets high-performance requirements for circuit board reliability while maintaining a structured, manageable formulation rather than an overly complex mixture.
Data Source
AI summary
A resin composition includes 100 parts by weight of vinyl-containing polyphenylene ether resin; 8 parts by weight to 20 parts by weight of a compound represented by the following formula (1); and 0.5 parts by weight to 2.5 parts by weight of a compound represented by the following formula (2),wherein each R1, R2, R3 and R4 respectively is C1-4 alkyl or H, and each R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17 and R18 respectively is C1 alkyl or H. An article manufactured using the aforesaid resin composition is also provided.