Polyphenylene Ether Resin Composition for Low-Dielectric PCB Laminates
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Solution Overview
Problem
Conventional polyphenylene ether resin compositions face challenges in achieving good dielectric properties and heat resistance while maintaining processability, particularly due to the reduction in molecular weight which affects heat resistance and flowability, and the use of low molecular weight crosslinking agents like isocyanuric acid triallyl ester and unsaturated olefin monomers leads to volatility issues during prepreg and laminate manufacturing.
Innovation Solution
A polyphenylene ether resin composition comprising functionalized polyphenylene ether resin with a number average molecular weight of 500-5000, combined with a crosslinking agent such as olefin resin with 10-50 wt% styrene structure and 1,2-addition butadiene structure, and a radical initiator, along with optional silane coupling agents and flame retardants, to form a stable and processable prepreg and copper clad laminate with improved dielectric and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the molecular weight of polyphenylene ether resins is reduced to decrease melting temperature and improve flowability, then the processability is improved, but the heat resistance is impaired
Solution Approach 1:
The patent combines low molecular weight polyphenylene ether resin (improving flowability) with a specific crosslinking agent system comprising isocyanuric acid triallyl ester and olefin resin with 1,2-addition butadiene structure (restoring heat resistance). This composite approach allows the resin to exhibit both good processability and high heat resistance after curing, resolving the contradiction between molecular weight reduction and heat resistance maintenance.
2Quantity of substance
If isocyanuric acid triallyl ester is used as crosslinking agent to improve dielectric properties, then the dielectric constant is reduced, but the manufacturing stability deteriorates due to volatility
Solution Approach 1:
The patent introduces olefin resin with 1,2-addition butadiene structure as an intermediary component that works synergistically with isocyanuric acid triallyl ester. The olefin resin acts as a carrier and stabilizer, reducing the volatility of the low molecular weight crosslinking agent while still allowing it to perform its dielectric function. This intermediary approach maintains the dielectric benefits while eliminating the manufacturing instability.
3Quantity of substance
If low molecular weight crosslinking agents are used to achieve good dielectric properties, then the dielectric loss tangent is reduced, but the storage stability deteriorates due to easy volatilization
Solution Approach 1:
The patent creates a composite crosslinking system where isocyanuric acid triallyl ester (providing low dielectric loss tangent) is combined with olefin resin having 1,2-addition butadiene structure (providing high boiling point and low volatility). This composite crosslinking agent system maintains the excellent dielectric properties while achieving good storage stability, as the olefin resin component prevents easy volatilization of the low molecular weight isocyanuric acid triallyl ester.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a resin composition with enhanced dielectric properties, lower dielectric constant, and improved heat resistance, suitable for high-frequency and high-speed applications, while maintaining good processability and storage stability, suitable for multi-layer printed circuit boards.
Implementation Method 1
a radical initiator, along with optional silane coupling agents and flame retardants, to form a stable and processable prepreg and copper clad laminate
Data Source
AI summary
The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.