PPS Semiconductor Casing Surface for Delamination-Resistant Sealing
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Solution Overview
Problem
Delamination between thermosetting resin and polyphenylene sulfide (PPS) casings in semiconductor devices leads to moisture and gas entry, reducing device reliability by concentrating stress at delaminated areas.
Innovation Solution
Exposing inorganic fillers from the PPS matrix on the casing surface facing the sealing material, combined with a silane coupling agent layer, to enhance adhesion and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a PPS casing with smooth surface is used, then the casing structure is simple and easy to manufacture, but delamination occurs between the sealing material and casing surface
Solution Approach 1:
The invention changes the surface parameter of the PPS casing by exposing inorganic filler particles through etching treatment. This modifies the surface composition and morphology, creating a rough surface with exposed inorganic fillers that provide anchoring points for the sealing material, thereby improving adhesion without fundamentally changing the casing manufacturing process
Solution Approach 2:
The invention creates a composite surface structure by exposing inorganic filler particles (such as silica, alumina, or titania) from the PPS matrix. This composite surface combines the properties of both the polymer matrix and the inorganic filler, providing both structural integrity and enhanced bonding capability with the sealing material
2Strength
If delamination occurs between sealing material and PPS casing, then stress concentration happens at contact parts, but preventing delamination requires complex surface treatment
Solution Approach 1:
The etching treatment changes the surface parameters of the PPS casing by controlling the exposure of inorganic filler particles. By adjusting etching time, temperature, and chemical concentration, the surface morphology can be optimized to provide uniform stress distribution while keeping the treatment process relatively simple
Solution Approach 2:
The exposed inorganic filler particles act as an intermediary between the PPS casing and the sealing material. These particles provide a transition zone that improves stress transfer and prevents stress concentration, while the silane coupling agent layer serves as a chemical mediator that enhances bonding between the inorganic filler and the organic sealing material
3Reliability
If delamination occurs at the casing surface, then moisture and corrosive gases can enter the device, but increasing adhesion strength may require additional layers or treatments
Solution Approach 1:
The invention changes the surface energy and wettability parameters of the PPS casing through etching and silane treatment. This creates a surface that is inherently more resistant to moisture and corrosive gases by improving the bonding interface, reducing the need for additional protective barriers
Solution Approach 2:
The silane coupling agent layer acts as a protective intermediary that seals the interface between the PPS casing and the external environment. This thin layer provides chemical resistance and moisture barrier properties while maintaining a relatively simple device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The exposed inorganic fillers and silane coupling agent layer significantly improve the adhesive strength between the casing and sealing material, reducing moisture and gas penetration and stress concentration, thereby enhancing the reliability of semiconductor devices.
Implementation Method 1
a silane coupling agent layer is preferably formed on the surface of the casing facing the sealing material
Implementation Method 2
the silane coupling agent layer is preferably in contact with the sealing material
Data Source
AI summary
A semiconductor device in which delamination between a casing including polyphenylene sulfide with an inorganic filler and a sealing material can be suppressed. A semiconductor device including a casing 16 including an inorganic filler in a matrix including polyphenylene sulfide; a semiconductor element 11 mounted on a laminated substrate 12; and a sealing material 20 sealing the semiconductor element, wherein the inorganic filler is exposed from the matrix on a surface F of the casing 16 facing the sealing material.