Polyphenylene Sulfide Laminated Body Adhesion via Primer Resin

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Solution Overview

Problem

Polyphenylene sulfide exhibits low adhesiveness to metal films, leading to issues like peeling and reduced conductivity, particularly in high-temperature environments, making it unsuitable for applications requiring strong adhesion and electroconductive patterns.

Innovation Solution

A laminated body comprising a polyphenylene sulfide resin composition with an elastomer and a primer resin layer, followed by a metal layer and metal-plating layer, enhances adhesiveness and maintains conductivity even at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If polyphenylene sulfide is used as a support material, then thermal resistance and chemical resistance are improved, but adhesiveness to metal films deteriorates

Engineering Contradiction:
Improvethermal resistanceVSAvoidadhesiveness
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

A primer resin layer is introduced as an intermediary between the polyphenylene sulfide support and the metal film. The primer resin layer has compatibility with both the polyphenylene sulfide and the metal film, enabling effective adhesion without compromising the thermal resistance of the support material.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention uses a composite structure consisting of polyphenylene sulfide support, primer resin layer, and metal film. This composite material approach allows each layer to contribute its specific properties: thermal resistance from polyphenylene sulfide, adhesion from primer resin, and electroconductivity from metal film.

Inventive Principle:
Principle #40Composite materials

2Strength

If surface etching is performed to enhance adhesiveness, then adhesiveness to metal film is improved, but surface smoothness deteriorates

Engineering Contradiction:
ImproveadhesivenessVSAvoidsurface smoothness
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The primer resin layer serves as a mediator that provides adhesion enhancement without requiring surface etching. This maintains the smooth mirror surface of the polyphenylene sulfide while achieving the necessary adhesiveness through the primer resin's chemical properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If surface roughening is performed to enhance adhesiveness, then adhesiveness to metal film is improved, but surface smoothness deteriorates

Engineering Contradiction:
ImproveadhesivenessVSAvoidsurface smoothness
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The primer resin layer acts as an intermediary that provides the necessary adhesion interface without modifying the surface morphology of the polyphenylene sulfide. This allows the support material to maintain its smooth mirror surface while achieving strong metal film adhesion through the primer resin's bonding properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Reliability

If copper plating is formed on etched surface, then electroconductive pattern is achieved, but peeling resistance deteriorates

Engineering Contradiction:
Improveelectroconductive patternVSAvoidpeeling resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The primer resin layer is introduced as an intermediary between the polyphenylene sulfide support and the copper plating layer. This primer layer provides a bonding interface that prevents peeling of the copper plating while maintaining the electroconductive pattern's functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The composite structure of polyphenylene sulfide support, primer resin layer, and copper plating layer creates a multi-functional system where each layer contributes specific properties: structural support and thermal resistance from polyphenylene sulfide, adhesion and peeling resistance from primer resin, and electroconductivity from copper plating.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminated structure ensures reliable adhesion and conductivity, suitable for applications such as connectors, optical communication, and electronic circuits, while maintaining performance in high-temperature environments.

Implementation Method 1

polyphenylene sulfide, which has a problem of a very low adhesiveness to a metal film formed by metal deposition, metal plating, and the like

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a primer resin layer (X), and a metal layer (B) and a metal-plating layer (C) that are laminated on the support in this order

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3315302B1Laminated body, molded article, electroconductive pattern, electronic circuit, and electromagnetic shield
Publication Date: 2022.02.23 DIC CORP
  • EP3315302B1 patent drawing
  • EP3315302B1 patent drawing
  • EP3315302B1 patent drawing

AI summary

The present invention provides a laminated body including a support (A) that includes a polyphenylene sulfide resin composition containing a polyphenylene sulfide (a1) and an elastomer (a2), and a metal layer (B) and a metal-plating layer (C) that are laminated on the support (A) in this order, wherein the elastomer (a2) is contained in the polyphenylene sulfide resin composition in an amount in the range of 0.3 to 90 parts by mass relative to 100 parts by mass of the polyphenylene sulfide (a1). The laminated body is excellent in adhesiveness between the polyphenylene sulfide as the support and the metal-plating layer, and also has a thermal resistance so as to maintain the excellent adhesiveness even when exposed to a high-temperature environment.