PPS Powder Coating for Thick Smooth Crack-Resistant Films
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Solution Overview
Problem
Existing film forming methods using polyphenylene sulfide powder coating materials struggle to create a smooth, thick film with a thickness of 500 μm or more without cracking, due to heat shrinkage and poor surface roughness, which limits their application in high-heat and chemical-resistant coatings for members like heat exchangers and excavating members.
Innovation Solution
A film forming method using a polyphenylene sulfide resin powder coating material, heated above its melting point within a range of 250 to 400°C, forms a film with a thickness of 500 μm or more and a surface roughness of 0.30 μm or less, utilizing a polyphenylene sulfide resin with an MFR of 10 to 100 g/10 min and an average particle size of 20 to 500 μm, without inorganic fillers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If polyphenylene sulfide powder coating material is heated to form a thick film, then film thickness increases, but surface roughness deteriorates and cracking occurs
Solution Approach 1:
The patent applies parameter changes by precisely controlling the heating temperature within the specific range of 250°C to 400°C. This temperature parameter control enables the polyphenylene sulfide resin to melt and form a uniform film without excessive heat shrinkage, thereby achieving both thick film formation (500 μm or more) and smooth surface finish (Ra ≤ 0.30 μm) simultaneously
Solution Approach 2:
The patent utilizes phase transitions of the polyphenylene sulfide resin, specifically the melting process occurring at temperatures between 250°C to 400°C. By controlling the resin to undergo phase transition from solid to liquid and then solidify upon cooling, the material forms a uniform, crack-free thick film with smooth surface, transforming the harmful heat shrinkage effect into a beneficial forming mechanism
2Volume of moving object
If polyphenylene sulfide powder coating material is heated to form a thick film, then film thickness increases, but cracking occurs on the coating film
Solution Approach 1:
The patent applies parameter changes by precisely controlling the heating temperature within the specific range of 250°C to 400°C. This temperature parameter control enables the polyphenylene sulfide resin to melt and form a uniform film without excessive heat shrinkage, thereby achieving both thick film formation (500 μm or more) and smooth surface finish (Ra ≤ 0.30 μm) simultaneously
Solution Approach 2:
The patent applies beforehand cushioning by selecting polyphenylene sulfide resin with specific properties (MFR of 10 to 100 g/10 min) and controlling heating parameters in advance to prevent cracking before it occurs. The resin formulation and heating conditions are designed to accommodate thermal expansion and film formation stresses, preventing crack initiation and propagation during the coating process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a smooth, thick film with high hardness and excellent heat and chemical resistance, preventing cracking and ensuring uniform coating on substrates like metal surfaces.
Implementation Method 1
heating the powder coating material at a temperature equal to or higher than a melting point of the polyphenylene sulfide resin
Implementation Method 2
due to heat shrinkage and poor surface roughness
Data Source
AI summary
Provided is a film forming method that can form a film having a thickness of 500 μm or more with a single coating of a substrate. The present disclosure is a film forming method using a powder coating material containing a polyphenylene sulfide resin, the method including heating the powder coating material at a temperature equal to or higher than a melting point of the polyphenylene sulfide resin and within a range of 250 to 400° C., in which a single coating of a substrate forms a film having a thickness of 500 um or more; and the obtained film has a surface roughness, Ra, of 0.30 μm or less.