Polyphenylene Sulfide Shape Memory Packer for Downhole Sealing

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Solution Overview

Problem

Current shape memory polymers used in downhole applications lack sufficient thermal and chemical stability and are costly, limiting their effectiveness in sealing and constricting boreholes.

Innovation Solution

A downhole element utilizing a thermally activated polyphenylene sulfide material, cured between 200° C. to 400° C. for less than 200 hours, which can be in the form of a closed cell foam, open cell foam, or solid, with enhanced thermal stability and shape memory properties, achieved through compounding with crosslinkers and additives, and processed to have improved mechanical and chemical resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional shape memory polymers are used in downhole applications, then shape memory functionality is achieved, but thermal and chemical stability is insufficient and cost is high

Engineering Contradiction:

Improvethermal and chemical stabilityVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by modifying the glass transition temperature (Tg) of the shape memory polymer through chemical composition adjustments and crosslinking density control. By changing the polymer's molecular structure and crosslinking parameters, the material achieves enhanced thermal stability suitable for downhole environments while maintaining shape memory functionality. The crosslinking process specifically alters the thermal and mechanical parameters of the polymer network.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite materials by combining shape memory polymers with crosslinking agents and potentially other functional additives to create a multi-component system. This composite approach enhances the thermal and chemical stability of the base polymer while the crosslinked network provides structural integrity and resistance to degradation in harsh downhole conditions.

Inventive Principle:

Principle #40Composite materials

2Reliability

If shape memory polymers are cured at high temperature for extended periods, then thermal stability improves, but processing time increases

Engineering Contradiction:

Improvethermal stabilityVSAvoidcuring time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent applies parameter changes by optimizing the curing temperature and time parameters to achieve the desired crosslinking degree. By carefully controlling these parameters, the patent reduces the required curing time while still achieving sufficient thermal stability. The specific curing conditions (temperature, time, atmosphere) are tuned to balance material performance with processing efficiency.

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If shape memory material is compressed to small size for deployment, then ease of installation improves, but recovery speed may be reduced

Engineering Contradiction:

Improveease of installationVSAvoidrecovery speed

Core Design Contradiction:

Ease of operationVSSpeed

Solution Approach 1:

The patent employs flexible shell structures by designing the shape memory polymer component as a compressible yet elastic element. The material's inherent flexibility allows it to be compressed into small packages for easy installation, while the crosslinked network maintains the structural integrity and elastic recovery capability needed for rapid deployment when activated.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent applies parameter changes by adjusting the glass transition temperature and elastic modulus of the shape memory polymer to optimize the balance between compressibility and recovery speed. By tuning these material parameters, the patent enables the material to be easily compressed for installation while maintaining rapid recovery characteristics when subjected to activating stimuli.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a shape memory material with improved thermal stability, rapid recovery rate, and near-quantitative recovery of pre-compressed dimensions, maintaining properties under elevated temperatures and chemical exposure, suitable for various downhole applications.

Implementation Method 1

Shape memory polymers (SMPs) are polymers that regain their original shape when heated above their glass transition temperature (Tg)

Methodology Applied

Scientific EffectGlass transition:

Implementation Method 2

the polyphenylene sulfide is a cure product of being cured at a temperature of about 200° C. to about 400° C.

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS8939222B2Shaped memory polyphenylene sulfide (PPS) for downhole packer applications

Publication Date: 2015.01.27 BAKER HUGHES CO

AI summary

A downhole element to isolate or complete a wellbore includes a shape memory material including polyphenylene sulfide. The polyphenylene sulfide is the cure product of being cured at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. The shape memory material is thermally activated between an actuated and unactuated shape, and the polyphenylene sulfide in the shape memory material is a closed cell foam, open cell foam, or solid.