PR Pulse Copper Plating Solution for Uniform Via and Through-Hole Filling
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Solution Overview
Problem
Conventional copper plating solutions fail to achieve uniform film thickness and excellent physical properties when used in PR pulse electrolysis, especially in substrates with densely packed through-holes and vias, due to non-uniform current distribution and the presence of nitrogen-based compounds that inhibit electrodeposition.
Innovation Solution
A copper plating solution for PR pulse electrolysis comprising a copper (II) ion, a polyvalent metal ion (such as iron (II) ion), and an unsaturated fatty acid, which together form a uniform copper film by controlling current distribution and suppressing copper dissolution, without using tertiary or quaternary amine compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional copper plating solutions are used in PR pulse electrolysis, then the plating process can be performed, but the film thickness is non-uniform and physical properties are poor
Solution Approach 1:
The patent changes the chemical parameters of the plating solution by replacing nitrogen-based compounds with unsaturated fatty acids and polyvalent metal ions. This parameter change resolves the contradiction by enabling uniform film thickness deposition while improving film physical properties through the specific chemical interactions of the new additive system.
Solution Approach 2:
The patent extracts and removes nitrogen-based compounds from the plating solution formulation. By taking out these harmful additives that cause non-uniform deposition and poor film properties, the invention achieves both uniform film thickness and improved physical properties through the remaining copper sulfate, unsaturated fatty acid, and polyvalent metal ion system.
2Productivity
If nitrogen-based compounds are used as additives, then electrodeposition can be enhanced, but film ductility is degraded
Solution Approach 1:
The patent converts the harmful effect of nitrogen-based compounds into a benefit by replacing them with unsaturated fatty acids and polyvalent metal ions that provide similar electrodeposition enhancement while improving film ductility. The new additive system maintains productivity while eliminating the harmful effect on film properties.
Solution Approach 2:
The patent changes the chemical composition parameters by substituting nitrogen-based additives with unsaturated fatty acids and polyvalent metal ions. This parameter change maintains electrodeposition efficiency while improving film ductility, resolving the contradiction between productivity and film strength.
3Manufacturing precision
If PR pulse electrolysis is used for via filling and through-hole filling, then filling performance is improved, but current distribution becomes non-uniform
Solution Approach 1:
The patent introduces unsaturated fatty acids and polyvalent metal ions as intermediary substances that mediate the current distribution during PR pulse electrolysis. These intermediaries facilitate uniform current distribution across the substrate surface while maintaining the enhanced filling performance of the pulse electrolysis process.
Solution Approach 2:
The patent changes the chemical parameters of the plating solution to include unsaturated fatty acids and polyvalent metal ions, which modify the electrochemical reactions and current distribution patterns. This parameter change enables uniform current distribution while maintaining superior via filling and through-hole filling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a copper film with uniform surface thickness and excellent physical properties, improving via filling and through-hole filling performance, while avoiding the need for nitrogen-based additives that degrade film ductility.
Implementation Method 1
allowing a PR pulse current to pass through the acidic copper plating solution to perform electrolytic copper plating by using an object to be plated as a cathode
Implementation Method 2
the polyvalent metal ion and the unsaturated fatty acid exert their effects when low current is applied. In the dense TH portion, sacrificial oxidation of the polyvalent metal ion becomes effective
Data Source
AI summary
An object of the present invention is to newly provide a copper plating solution for PR pulse electrolysis and a copper plating method by a PR pulse electrolysis method. Provided is a copper plating solution for PR pulse electrolysis, comprising a copper (II) ion, a polyvalent metal ion (excluding copper (II) ions), and an unsaturated fatty acid.