Pre-Encapsulated Cavity Interposer for High-Density Semiconductor Packaging
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Solution Overview
Problem
Current semiconductor device packages face challenges in minimizing physical space while increasing the number of devices, requiring more efficient interconnection techniques between devices and with printed circuit boards, as existing methods like lead frames, wire bonds, and solder bumps are not fully optimized for high-density configurations.
Innovation Solution
The development of pre-encapsulated cavity interposers, which involve forming a dielectric encapsulation material around conductive traces to create a cavity for semiconductor devices, with exposed connection areas for attachment and interconnection, allowing for efficient packaging and stacking of multiple devices in a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frames and wire bonds are used to connect semiconductor devices, then devices can be interconnected, but the physical space occupied increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the lead frame structure from the packaging system. Instead of using traditional lead frames to support and interconnect devices, the invention uses direct die-to-die bonding with solder bumps, removing the unnecessary intermediary structure and reducing overall package volume while maintaining interconnection functionality
Solution Approach 2:
The patent introduces a new intermediary structure - the molded compound encapsulant with integrated cavity and trace - that replaces both the lead frame and wire bond functions. This single structure provides mechanical support, electrical interconnection, and environmental protection, simplifying the overall architecture and reducing space requirements
2Reliability
If lead frames and wire bonds are used to connect semiconductor devices, then devices can be interconnected, but the device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges multiple functions into a single integrated structure. The molded compound encapsulant combines the support function, interconnection function, and protection function into one component, eliminating the need for separate lead frames and wire bonds, thereby reducing manufacturing complexity
Solution Approach 2:
The patent replaces the mechanical wire bonding process with a more efficient electrical interconnection method using solder bumps and conductive traces. This substitution eliminates the complex mechanical manipulation required for wire bonding and replaces it with automated reflow soldering processes
3Reliability
If conventional packaging methods are used, then semiconductor devices can be connected to printed circuit boards, but the physical space occupied increases
Solution Approach 1:
The patent transitions from two-dimensional planar packaging to three-dimensional vertical stacking. Multiple semiconductor devices are stacked vertically and interconnected through the molded compound encapsulant, enabling high-density integration in the vertical dimension while minimizing footprint area
Data Source
AI summary
Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.