Pre-measurement Alignment for Exposure Apparatus Throughput
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Solution Overview
Problem
Current photolithography processes face challenges in achieving high throughput and accuracy due to deformation and measurement errors in alignment marks, leading to suspension of exposure processing and reduced throughput, especially when complex calculations are required for correction.
Innovation Solution
A pre-measurement processing method that measures marks on a substrate before transfer to the exposure apparatus, allowing for optimal mark selection and alignment, and notifies waveform data to relevant devices for evaluation and correction, thereby reducing alignment errors and enabling prompt exposure processing with improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex calculations are performed for alignment correction during exposure processing, then alignment accuracy is improved, but processing time increases and throughput decreases
Solution Approach 1:
The patent performs complex alignment calculations and mark measurements in advance, before the actual exposure processing. By pre-measuring mark positions and pre-calculating alignment correction values, the system eliminates the need for time-consuming calculations during exposure, thereby maintaining high alignment accuracy while improving throughput.
2Manufacturing precision
If alignment marks are measured and processed during exposure sequence, then alignment accuracy is maintained, but processing suspension occurs and throughput is reduced
Solution Approach 1:
The patent measures alignment marks and performs all necessary alignment processing before the exposure sequence begins. This preliminary measurement and calculation approach ensures that no time is lost during the actual exposure processing, as all alignment corrections are already determined and ready to be applied.
3Manufacturing precision
If pre-measurement and optimal mark selection are performed, then alignment accuracy is improved, but additional processing time is required
Solution Approach 1:
The patent performs mark selection and pre-measurement in advance, identifying optimal marks and calculating their positions before exposure. This preliminary processing, while adding complexity to the overall system, enables simpler and faster execution during the actual exposure sequence, as the complex decision-making has already been completed.
Data Source
AI summary
high performance and high quality micro devices, etc. are produced highly efficiently at a high throughput. Before transferring a wafer W to an exposure apparatus 200 for exposing the wafer W, marks formed on the wafer W is measured by an in-line measurement device 400 and a measurement result and/or a result of performing calculation processing on the measurement result is notified to the exposure apparatus 200. In the exposure apparatus 200, a measurement condition is optimized based on the notified result and an alignment processing and other processing are performed.