Pre-molded Clip Interconnect for Multi-Die Semiconductor Packages
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Solution Overview
Problem
Conventional semiconductor packages typically contain a single die, limiting their functionality and requiring miniaturization for various electronic applications, while wirebonded connections compromise electrical and thermal performance and increase costs.
Innovation Solution
The use of semiconductor packages with multiple dies connected by a premolded clip, which provides a larger cross-sectional area for interconnection through standoffs, improving electrical and thermal performance and reducing costs compared to wirebonded connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonded connections are used to connect dies, then the package can be manufactured with conventional processes, but the electrical resistance is high and thermal performance is compromised
Solution Approach 1:
The patent replaces wirebonded mechanical connections with a clip-based mechanical interconnection system. The clip structure provides direct mechanical and electrical/thermal contact between dies and the substrate, eliminating the need for wire bonds and thereby reducing electrical resistance and improving thermal performance while maintaining manufacturability through conventional semiconductor packaging processes
Solution Approach 2:
The patent changes the interconnection parameter from thin wire bonds to a substantial clip structure with larger cross-sectional area. This parameter change directly improves electrical conductivity (lower resistance) and thermal conduction while the clip can be attached using standard semiconductor manufacturing techniques
2Adaptability or versatility
If a single die is used in the package, then the manufacturing process is simple, but the functionality is limited
Solution Approach 1:
The patent merges multiple dies into a single package using a clip-based interconnection system. The clip structure enables multiple dies to be electrically and thermally connected to the substrate and to each other, thereby enhancing overall functionality and versatility while managing the complexity through a unified mechanical interconnection approach
Solution Approach 2:
The clip structure serves multiple functions simultaneously: it provides mechanical support for multiple dies, establishes electrical connections, and facilitates thermal management. This multi-functionality enables enhanced package capabilities without proportionally increasing manufacturing complexity
3Volume of moving object
If the package is miniaturized for various electronic applications, then the package size is reduced, but the interconnection area is limited
Solution Approach 1:
The patent transitions from planar wirebond connections to a three-dimensional clip structure that extends vertically from the substrate. This dimensional change allows the interconnection area to be increased in the vertical dimension while maintaining a compact horizontal footprint, thereby improving electrical and thermal performance without increasing overall package size
Data Source
AI summary
Semiconductor packages that contain multiple dies and methods for making such packages are described. The semiconductor packages contain a leadframe with multiple dies and also contain a single premolded clip that connects the dies. The premolded clip connects the solderable pads of the source die and gate die to the source and gate of the leadframe via standoffs. The solderable pads on the dies and on the standoffs provide a substantially planar surface to which the premolded clip is attached. Such a configuration increases the cross-sectional area of the interconnection when compared to wirebonded connections, thereby improving the electrical (RDSon) and the thermal performance of the semiconductor package. Such a configuration also lowers costs relative to similar semiconductor packages that use wirebonded connections. Other embodiments are described.