Pre-reflow Component Mounting Position Determination Using Synthesis Image
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Solution Overview
Problem
In the manufacturing of printed boards via soldering, existing methods fail to accurately determine the appropriate mounting position of components on boards before the reflow process, leading to defective products and increased repair costs due to inefficiencies in defect detection and positioning accuracy.
Innovation Solution
An information processing apparatus is developed, incorporating an image processing unit and a determination unit that generates a synthesis image by combining pre-mount images, adsorption information, and setting information, using a machine learning model to assess the appropriateness of component placement on the board, thereby determining the correct mounting position before the reflow process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If component mounting position is determined only based on adsorption state in component mounting apparatus, then determination process is simple, but mounting position accuracy is insufficient due to ignoring board state
Solution Approach 1:
The patent combines multiple information sources (pre-mount image showing board state, adsorption information from component mounting apparatus, and setting information) into a synthesized image for comprehensive mounting position determination. This merging approach ensures both board conditions and component adsorption states are considered together, resolving the contradiction between simple determination and accurate positioning.
Solution Approach 2:
The patent performs image processing to generate a pre-mount image before component mounting, capturing the board state in advance. This preliminary action allows the system to assess solder paste conditions and board readiness before making mounting decisions, improving position accuracy without significantly increasing overall process complexity.
2Reliability
If defect detection is performed prior to reflow process, then loss of members and repair steps are reduced, but defect detection accuracy is insufficient without considering both board state and component adsorption state
Solution Approach 1:
The patent implements a feedback mechanism where the determination result (whether component should be mounted) is fed back to control the component mounting apparatus. This closed-loop feedback ensures that only appropriately positioned components are mounted, improving defect detection accuracy while maintaining productivity by preventing defective mounts before they occur.
Solution Approach 2:
The system performs comprehensive determination of mounting appropriateness before the reflow process by analyzing both board state and component adsorption. This preliminary assessment prevents defective products from being created in the first place, reducing both loss of members and subsequent repair needs while maintaining manufacturing efficiency.
3Manufacturing precision
If comprehensive determination considering both board state and component adsorption state is performed, then defectiveness is reduced, but processing time and complexity increase
Solution Approach 1:
The patent applies partial action by focusing image processing and determination only on specific regions where components are to be mounted, rather than analyzing the entire board. This selective approach maintains high manufacturing precision for critical mounting positions while reducing overall processing time and computational complexity.
Data Source
AI summary
In an embodiment, an information processing apparatus includes an image processing unit and a determination unit. The image processing unit generates a synthesis image by synthesizing a component with a pre-mount image prior to mounting of the component onto a board, based on the pre-mount image, adsorption information indicating an adsorption state of the component in a component mounting apparatus, and setting information indicating a setting position set as a position where the component is to be mounted on the board. The determination unit determines whether or not it is appropriate to mount the component at the setting position by inputting, to a machine learning model outputting an inspection result of a post-reflow inspection from an input of image data based on a pre-reflow image, image data based on the pre-mount image and the synthesis image.