Pre-Shaped Back Plate and Spring Sheet for Socket Pin Contact

Solution Overview

Problem

The increasing demand for higher computing power and faster processing times leads to higher-density connectors, causing warpage in back plates and printed circuit boards, which reduces the contact force between socket pins and integrated circuits, thereby affecting the performance of integrated circuits.

Innovation Solution

The use of pre-shaped back plates and spring sheets between the printed circuit board and the back plate to compensate for warpage, ensuring uniform socket pin contact force and damping vibrations, while spacers can be used to further stabilize the setup.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If higher-density connectors are used to increase computing power and processing speed, then computing performance is improved, but warpage in back plates and printed circuit boards occurs, reducing pin contact force

Engineering Contradiction:

Improvecomputing performanceVSAvoidpin contact force

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The back plate is pre-shaped with a curved configuration before assembly to anticipate and compensate for the warpage that will occur during operation. This preliminary shaping ensures that when the back plate is installed and subjected to thermal and mechanical loads, the pre-compensated geometry maintains proper pin contact force despite the expected deformation

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention changes the geometric parameter of the back plate from a flat configuration to a pre-shaped curved configuration. This parameter change in the back plate geometry allows it to counteract the warpage effects, maintaining consistent pin contact force across the socket interface even as computing density increases

Inventive Principle:

Principle #35Parameter changes

2Speed

If higher-density connectors are used to transfer signals faster, then processing speed is improved, but warpage reduces manufacturing precision of the assembly

Engineering Contradiction:

Improveprocessing speedVSAvoidpin contact uniformity

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The back plate is pre-shaped with a curved configuration before assembly to anticipate and compensate for the warpage that will occur during operation. This preliminary shaping ensures that when the back plate is installed and subjected to thermal and mechanical loads, the pre-compensated geometry maintains proper pin contact force despite the expected deformation

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention changes the geometric parameter of the back plate from a flat configuration to a pre-shaped curved configuration. This parameter change in the back plate geometry allows it to counteract the warpage effects, maintaining consistent pin contact force across the socket interface even as computing density increases

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If conventional flat back plates are used, then device complexity is low, but warpage causes non-uniform pin contact force reducing reliability

Engineering Contradiction:

Improveback plate structureVSAvoidpin contact force consistency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The back plate is pre-shaped with a curved configuration before assembly to anticipate and compensate for the warpage that will occur during operation. This preliminary shaping ensures that when the back plate is installed and subjected to thermal and mechanical loads, the pre-compensated geometry maintains proper pin contact force despite the expected deformation

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention changes the geometric parameter of the back plate from a flat configuration to a pre-shaped curved configuration. This parameter change in the back plate geometry allows it to counteract the warpage effects, maintaining consistent pin contact force across the socket interface

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution maintains consistent contact force across all areas of the socket, enhances performance by preventing warpage-induced performance degradation, and reduces vibrations, leading to improved reliability and efficiency in computing systems.

Implementation Method 1

spring sheets between the printed circuit board and the back plate to compensate for warpage

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

spring sheets between the printed circuit board and the back plate to compensate for warpage, ensuring uniform socket pin contact force and damping vibrations

Methodology Applied

Scientific EffectVibration damping: Damping

Data Source

PatentUS20230014898A1Methods and apparatus to improve pin contact of a component stack

Publication Date: 2023.01.19 INTEL CORP

AI summary

Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.