Selective EMI Shielding on Slotted Substrates Before Singulation

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Solution Overview

Problem

Semiconductor devices are susceptible to electromagnetic interference (EMI) and other inter-device interference, which can cause manufacturing defects due to unit movement during processing after singulation, leading to misalignment and malfunction.

Innovation Solution

A slotted substrate is used with pre-formed slots to allow a shielding layer to be applied before singulation, ensuring electrical connection to conductive layers without full singulation, reducing post-singulation handling issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If full singulation is performed before applying shielding layer, then individual packages can be handled separately, but unit movement during processing causes misalignment and manufacturing defects

Engineering Contradiction:

Improveindividual package handlingVSAvoidalignment accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The substrate is divided into individual package regions separated by slots, allowing each package to be independently defined while remaining connected to the substrate. This segmentation enables targeted shielding application to specific packages without requiring complete singulation, thus preventing unit movement while maintaining individual package identification and handling capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The slots are pre-formed in the substrate before the shielding layer is applied. This preliminary action creates predefined pathways that guide the shielding layer formation process and establish stable package positions before any shielding material is deposited, eliminating alignment issues that would occur with post-singulation handling.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If shielding layer is applied before singulation, then manufacturing defects are reduced, but electrical connection to conductive layers must be ensured through slots

Engineering Contradiction:

Improvemanufacturing defect rateVSAvoidsubstrate structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The substrate structure is segmented with slots that serve dual purposes: they define individual package boundaries for stable shielding application and provide pathways for electrical connections. This segmentation creates a balanced structure that achieves both manufacturing reliability and electrical functionality without requiring complex additional components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The slots in the substrate serve multiple functions simultaneously: they act as separation boundaries for individual packages, provide pathways for shielding layer formation, and enable electrical connections between the shielding layer and conductive layers. This multi-functionality reduces overall device complexity while achieving the desired manufacturing reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If slots are formed in substrate, then shielding layer can be applied before singulation, but substrate structure becomes more complex

Engineering Contradiction:

Improveshielding application processVSAvoidsubstrate structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The slots are formed in the substrate as a preliminary step before shielding layer application. This preliminary slot formation simplifies the subsequent shielding application process by providing pre-defined boundaries and pathways, eliminating the need for complex masking or alignment procedures during shielding deposition.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate is segmented into discrete package regions by the slots, creating a modular structure that simplifies the shielding application process. Each slot-defined region can be independently treated during shielding formation, allowing for simplified process control and reduced manufacturing complexity despite the added substrate feature.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing defects by stabilizing semiconductor packages during processing, enhancing reliability and efficiency in EMI shielding.

Implementation Method 1

A conductive shielding layer is formed over the discrete components and the semiconductor die to shield the semiconductor device from electromagnetic interference (EMI) and other interference

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12444694B2Semiconductor device and method of forming selective EMI shielding with slotted substrate

Publication Date: 2025.10.14 STATS CHIPPAC LTD

AI summary

A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.