Pre Space Transformer for Semiconductor Probe Pitch Compensation

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Solution Overview

Problem

The increasing integration of semiconductor devices requires high-precision inspecting apparatuses, such as probe apparatuses, which demand fine pitches for probe pins, necessitating a space transformer to compensate for pitch differences between the semiconductor integrated circuit and the circuit board, but existing space transformers have complex structures and inefficient manufacturing processes.

Innovation Solution

A pre space transformer with a substrate having individual and common electrodes in a grid pattern, covered by an insulating film, which simplifies the structure and allows for selective exposure of required electrodes, enabling efficient manufacturing and pitch compensation between semiconductor devices and circuit boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a space transformer is designed with fine pitch probe pins to satisfy high integration inspecting requirements, then measurement precision is improved, but device complexity increases due to the need for pitch compensation structures

Engineering Contradiction:

Improveinspecting precisionVSAvoidspace transformer structure

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The space transformer is divided into a substrate layer and an electrode layer with distinct functional zones. The electrode layer is segmented into signal electrodes, power electrodes, and ground electrodes that are spatially separated and independently configured, allowing each segment to perform its specific function without interfering with others, thus reducing overall structural complexity while maintaining fine pitch capabilities

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar electrode arrangements to a three-dimensional configuration where electrodes are positioned at different heights and depths within the substrate. This dimensional change allows pitch compensation to occur in the vertical dimension rather than requiring complex lateral arrangements, thereby reducing device complexity while achieving the required measurement precision

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If a complex space transformer structure is used to achieve pitch compensation, then adaptability is improved, but ease of manufacture deteriorates due to difficult assembly processes

Engineering Contradiction:

Improvepitch compensation capabilityVSAvoidmanufacturing process

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The substrate and electrode layer are merged into a single integrated component where electrodes are directly formed on or within the substrate material. This merging eliminates the need for separate assembly steps to attach electrodes to the substrate, greatly simplifying the manufacturing process while maintaining the adaptability required for pitch compensation through the integrated electrode-substrate configuration

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it provides mechanical support, acts as an insulating layer, serves as a mounting platform for electrodes, and enables pitch compensation through its structural design. This multi-functionality reduces the number of separate components needed, thereby improving ease of manufacture while maintaining adaptability for various pitch compensation requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If traditional space transformer manufacturing processes are used, then manufacturing precision can be maintained, but productivity decreases due to long manufacturing periods

Engineering Contradiction:

Improveelectrode positioning accuracyVSAvoidmanufacturing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

Electrodes are pre-positioned and fixed to the substrate in a preliminary manufacturing step before final assembly. This preliminary action ensures precise electrode positioning is achieved early in the process, allowing subsequent steps to proceed quickly without requiring complex alignment procedures, thereby maintaining manufacturing precision while improving overall productivity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent eliminates intermediate manufacturing steps such as separate electrode attachment, alignment, and bonding processes by using a direct formation method where electrodes are created in situ on the substrate. This skipping of unnecessary steps rushes through the manufacturing process efficiently while maintaining precision through the simplified direct formation approach

Inventive Principle:

Principle #21Skipping (Rushing through)

Data Source

PatentUS9947457B2Pre space transformer, space transformer manufactured using the pre space transformer, and semiconductor device inspecting apparatus including the space transformer

Publication Date: 2018.04.17 SEMCNS CO LTD

AI summary

Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.