Pre-stretched Substrate Manufacturing via Thermal Expansion
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Solution Overview
Problem
Existing methods for manufacturing pre-stretched substrates fail to produce substrates with large areas and uniform pre-stretching amounts, leading to poor stretching performance in flexible display devices.
Innovation Solution
A method involving the sequential formation of film layers on a carrier plate at elevated temperatures with different thermal expansion coefficients, followed by separation to create a pre-stretched substrate, ensuring uniform thermal expansion and contraction, and optionally including stress and stress adjustment layers for enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is made of a flexible material with good deformability and other functional layers are formed on it, then the flexible display device can withstand large bending, stretching or torsional deformation, but the substrate cannot achieve uniform pre-stretching amount and large area
Solution Approach 1:
The patent utilizes thermal expansion by forming the substrate and functional layers at elevated temperatures where materials expand, then cooling to room temperature where differential thermal contraction creates uniform pre-stretching. The substrate and functional layers have different thermal expansion coefficients, causing controlled stress distribution that achieves uniform pre-stretching across large areas without mechanical stretching.
Solution Approach 2:
The patent changes the temperature parameter during manufacturing, forming layers at high temperature and then cooling to room temperature. This parameter change exploits thermal expansion/contraction to achieve uniform pre-stretching, transforming the substrate from a mechanically stretched state to a thermally induced pre-stretched state with uniform deformation across the entire area.
2Ease of manufacture
If existing methods are used to manufacture pre-stretched substrates, then the process is simpler, but the substrates cannot achieve large area with uniform pre-stretching amounts
Solution Approach 1:
The patent applies thermal expansion to enable large-area substrate manufacturing with uniform pre-stretching. By forming layers at elevated temperatures and utilizing differential thermal contraction during cooling, the method achieves uniform stress distribution across large areas, overcoming the area limitations of conventional mechanical stretching methods while maintaining manufacturing feasibility.
3Reliability
If the substrate is pre-stretched to improve stretching performance, then the service life of flexible display devices is extended, but the manufacturing process becomes more complex
Solution Approach 1:
The patent uses thermal expansion to create uniform pre-stretching that enhances stretching performance and extends device service life. The differential thermal contraction between substrate and functional layers during cooling generates controlled tensile stress in the substrate, improving its stretching performance and reliability without requiring complex mechanical pre-stretching equipment or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of pre-stretched substrates with uniform pre-stretching amounts, improved resistance to water and oxygen, and enhanced stress tolerance, effectively extending the service life of flexible display devices.
Implementation Method 1
sequentially forming at least two film layers on a carrier plate at a temperature higher than a first temperature threshold; wherein thermal expansion coefficients of the at least two film layers are different
Implementation Method 2
the at least two film layers have different degrees of contraction in a normal temperature environment
Data Source
AI summary
The present disclosure discloses a pre-stretched substrate, a method for manufacturing the same, an electronic device and a method for manufacturing the same. The method for manufacturing a pre-stretched substrate includes: sequentially forming at least two film layers on a carrier plate at a temperature higher than a first temperature threshold; wherein thermal expansion coefficients of the at least two film layers are different; and separating the at least two film layers from the carrier plate, thereby obtaining the pre-stretched substrate. The at least two film layers have different degrees of contraction in a normal temperature environment.