Pre-applied Adhesive Workpiece Carrier for Wafer Sawing
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Solution Overview
Problem
The existing methods for fixing material blocks to machining devices using expendable workpiece carriers are costly due to the need for two-component adhesives that require immediate mixing and application, limiting flexibility and increasing production time, especially in the photovoltaic and microelectronics industries.
Innovation Solution
A method utilizing an expendable workpiece carrier with a pre-applied, inert adhesive that can be activated externally, such as by heat, pressure, or infrared, allowing for flexible storage and application, eliminating the need for industrial robots and reducing process time, and enabling efficient bonding of material blocks to machining devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If two-component adhesives are used for bonding material blocks to workpiece carriers, then bonding strength is achieved, but process complexity and cost increase due to immediate mixing requirements and limited pot life
Solution Approach 1:
The adhesive is pre-applied to the workpiece carrier in a non-adhesive state before use. This preliminary action eliminates the need for on-site mixing of two-component adhesives and allows the adhesive to remain stable during storage and handling, only becoming adhesive when activated by external influence during the bonding process.
Solution Approach 2:
The adhesive's key parameter (adhesiveness) is changed from inactive to active state through external influence such as heat, pressure, or infrared radiation during the bonding process. This parameter change allows the adhesive to provide sufficient bonding strength only when needed, while remaining stable and non-adhesive during storage and handling.
2Strength
If two-component adhesives requiring immediate mixing are used, then bonding is achieved, but production time increases and flexibility is reduced
Solution Approach 1:
The adhesive is pre-applied to the workpiece carrier in advance during manufacturing or storage, eliminating the time-consuming on-site mixing step. The adhesive remains in a stable, non-adhesive state until activation, allowing workpiece carriers to be prepared ahead of time and stored for later use without degradation.
Solution Approach 2:
The adhesive activates itself through external influence (heat, pressure, infrared) during the bonding process without requiring external mixing or activation equipment. This self-service capability eliminates the need for complex mixing systems and reduces production time.
3Manufacturing precision
If industrial robots are used for adhesive mixing and application, then bonding precision is improved, but capital and operational costs increase substantially
Solution Approach 1:
The adhesive is pre-applied to the workpiece carrier during its manufacturing process rather than requiring separate mixing and application equipment. This preliminary action eliminates the need for expensive industrial robots and associated mixing equipment, while still achieving precise adhesive placement through the extrusion or coating process integrated into workpiece carrier production.
Solution Approach 2:
The workpiece carrier with pre-applied adhesive is treated as a disposable unit that can be stored and used as needed. This approach eliminates the need for expensive, reusable adhesive application equipment, as each workpiece carrier comes ready-to-use with its adhesive already in place.
4Strength
If adhesive with limited pot life is used, then bonding effectiveness is maintained, but workflow flexibility is reduced
Solution Approach 1:
The adhesive's key parameter (adhesiveness) is controlled through external influence, allowing it to remain inactive during storage and handling, then activate only when needed for bonding. This parameter control provides unlimited storage life and workflow flexibility while maintaining effective bonding when activated by heat, pressure, or infrared radiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces unit costs and increases throughput by simplifying the adhesive application process, allowing for ready-to-use expendable workpiece carriers that can be stored and applied quickly, enhancing the efficiency of machining processes like sawing in the photovoltaic and microelectronics industries.
Implementation Method 1
the adhesive, whose adhesive strength is reduced by immersion in surrounding media (e.g., water, acids, alkalis) and/or by heat and/or the application of an electrical potential
Implementation Method 2
the material block is adhesively bonded to an expendable workpiece carrier
Data Source
AI summary
A method for fixing a material block to a machining device for mechanically machining the material block, in particular to a wire saw for cutting the material block into individual wafers. In the method, the material block is adhesively bonded to an expendable workpiece carrier, and the workpiece carrier is connected to the machining device. For this purpose, the expendable workpiece carrier is provided on at least one surface with an already pre-applied layer of an adhesive that can be activated only by an external influence. The material block is then adhesively bonded to the workpiece carrier by corresponding activation of the adhesive. The method dispenses with complex steps for mixing and applying a two-component adhesive before performing machining as well as with the industrial robots used until now for this purpose. The method therefore saves time and costs in the machining process, in particular in the production of wafers.