Pre-applied Supporting Material for IC Package Bonding
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Solution Overview
Problem
In integrated circuit packaging, the bonding of device dies to package substrates often results in unbalanced pressure during the molding process, leading to potential deflection and void formation due to the absence of adequate support between the components, which can cause connector bridging and warpage.
Innovation Solution
A supporting material, such as a dielectric or non-conductive film, is applied to the surface of the package component before bonding, filling the center region between connectors, providing structural support and ensuring balanced pressure distribution during molding, thus preventing deflection and void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If device dies are bonded to package substrates without supporting material, then the bonding process is simpler, but unbalanced pressure during molding causes deflection and void formation
Solution Approach 1:
A supporting material is applied to the device die before bonding to the package substrate. This preliminary action provides structural support that prevents deflection during subsequent molding processes, ensuring balanced pressure distribution without complicating the bonding procedure.
Solution Approach 2:
The supporting material acts as an intermediary element between the device die and the package substrate. It mediates the mechanical stresses during molding by distributing pressure evenly, preventing direct transmission of unbalanced forces that would cause deflection and void formation.
2Manufacturing precision
If supporting material is applied before bonding, then deflection and void formation are prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The supporting material is applied in advance to the device die before bonding. This preliminary preparation ensures that structural support is in place before molding begins, preventing deflection and void formation while integrating smoothly into the existing manufacturing workflow.
3Device complexity
If no supporting material is used, then the structure is simpler, but connector bridging occurs due to deflection
Solution Approach 1:
The supporting material serves as an intermediary that distributes mechanical loads evenly across the device die structure. This prevents localized deflection that would otherwise cause connector bridging, thereby protecting connector integrity without significantly complicating the overall device structure.
4Productivity
If molding is performed without supporting material, then the process is faster, but voids form due to unbalanced pressure
Solution Approach 1:
The supporting material is pre-applied to the device die before the molding process begins. This preparation enables the molding operation to proceed at normal speed without causing void formation, as the supporting material ensures balanced pressure distribution from the start of the molding cycle.
Data Source
AI summary
A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is disposed in a gap between the first package component and the second package component. A molding material is disposed in the gap and encircling the supporting material.