Pre-Bent Circuit Board Assembly for Curved Back Frame Bonding
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Solution Overview
Problem
The manufacturing of electronic devices with curved surfaces poses challenges in yield and reliability due to the mismatch in radii of curvature between components, leading to potential cracking and poor adhesion.
Innovation Solution
A method involving pre-bending circuit boards and protective substrates to match their radii of curvature with back frames, using patterned adhesives to improve adhesion and reduce cracking, and incorporating design features like grooves and through holes to eliminate air bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the circuit board is directly attached to the back frame without pre-bending, then the manufacturing process is simple, but the radius of curvature mismatch causes cracking and poor adhesion
Solution Approach 1:
The circuit board undergoes pre-bending treatment before attachment to the back frame. This preliminary action adjusts the circuit board's radius of curvature to match the back frame, preventing cracking and adhesion failures that would occur with direct attachment of a flat board.
Solution Approach 2:
The radius of curvature of the circuit board is changed through pre-bending to match the back frame's curvature parameter. This parameter adjustment ensures compatibility between components and prevents structural failures during assembly and operation.
2Strength
If the adhesive area covers the entire surface, then adhesion strength is maximized, but air bubbles are trapped causing defects
Solution Approach 1:
The adhesive layer is segmented into multiple regions with different properties. Some areas have higher adhesive strength while others are designed to allow air bubble escape. This segmentation maintains overall adhesion strength while eliminating the harmful effect of trapped air bubbles.
Solution Approach 2:
The adhesive structure incorporates intermediary elements such as channels or voids that facilitate air bubble escape during assembly. These intermediary features act as pathways that allow air to be expelled while the adhesive maintains its bonding function.
3Ease of manufacture
If the radius of curvature difference between protective substrate and back frame is large, then assembly is easier, but the final product has poor curvature matching and appearance quality
Solution Approach 1:
The protective substrate is pre-bent to a preliminary radius of curvature that is larger than the final required curvature but smaller than the back frame's radius. This preliminary shaping facilitates easier assembly while allowing subsequent processing to achieve the precise final curvature match.
Solution Approach 2:
The patent incorporates a gradual curvature transition design that cushions the difference between the protective substrate and back frame curvatures. This gradual transition prevents sudden stress concentrations and allows for better final curvature matching while maintaining assembly ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the manufacturing yield and reliability of electronic devices by ensuring proper curvature alignment and adhesive effectiveness, reducing the risk of cracking and improving heat dissipation.
Implementation Method 1
attaching the circuit board having the first radius of curvature to the back frame through an adhesive
Data Source
AI summary
An electronic device and a method of manufacturing the electronic device are provided. The method of manufacturing the electronic device includes the following steps: providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; attaching the circuit board having the first radius of curvature to the back frame through an adhesive. A difference between the first radius of curvature and the second radius of curvature is within 10%.