Pre-Bent Circuit Board Layout for Seamless Display Splicing
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Solution Overview
Problem
The existing chip-on-film packaging technology faces challenges with circuit boards protruding from the sides of pixel array substrates, leading to issues with electrical connectivity and substrate integrity during splicing of display devices.
Innovation Solution
A display device and manufacturing method utilizing a thermoplastic substrate with a first bend formed by thermoplastics, where the circuit board is electrically connected to bonding pads on the pixel array substrate and bent from the front surface to the back surface, preventing protrusion and ensuring stable contact and reduced vertical distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is bent from the front surface to the back surface of the pixel array substrate, then the vertical distance is reduced and splicing continuity is improved, but the circuit board may rebound and lose electrical connectivity
Solution Approach 1:
The circuit board is pre-bent into a bent shape before being mounted on the pixel array substrate. This preliminary bending action ensures that when the circuit board is installed, it naturally conforms to the required curved path from the front surface to the back surface, reducing vertical distance while maintaining stable contact and electrical connectivity without rebound
Solution Approach 2:
The circuit board's physical shape is changed from a flat configuration to a pre-bent configuration. This parameter change in the circuit board's geometry allows it to achieve the desired bent shape that reduces vertical distance while maintaining reliable electrical connection to the bonding pads
2Reliability
If the circuit board protrudes from the side of the pixel array substrate, then electrical connectivity is maintained, but the splicing continuity and display seamlessness are degraded
Solution Approach 1:
The circuit board is configured to extend in three dimensions, bending from the front surface through the side to the back surface of the pixel array substrate. This dimensional transformation allows the circuit board to maintain electrical connectivity while avoiding protrusion from the side, thereby achieving splicing continuity and seamlessness in the display
3Shape
If the circuit board is bent to reduce vertical distance, then splicing seamlessness is improved, but contact stability may be compromised
Solution Approach 1:
The circuit board is pre-bent into the final desired shape before installation. This preliminary action ensures that when mounted, the circuit board maintains stable contact with the bonding pads while achieving the bent configuration necessary for splicing seamlessness, preventing both rebound and loss of contact stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents circuit board rebound and maintains electrical connectivity, reducing the vertical distance between the circuit board and the pixel array substrate, enhancing the seamless splicing of display devices and improving display continuity.
Implementation Method 1
The thermoplastic substrate is heated to form a first bend formed by thermoplastics in the thermoplastic substrate
Data Source
AI summary
A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.