Preceramic Polymer Adhesive for Microelectronics Thermal Stability
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Solution Overview
Problem
Conventional adhesives used in microelectronics manufacturing lack optimal temperature stability and thermal conductivity, often degrading at high temperatures and having coefficients of thermal expansion that vary significantly, making them unsuitable for complex microelectronic device layer transfers.
Innovation Solution
A thermally conductive and electrically insulating adhesive composition comprising a silicon-based pre-ceramic polymer and thermally conductive, electrically insulating inorganic fillers, which can be crosslinked at low temperatures and maintains stability beyond 250°C, with a thermal conductivity of at least 2 W/m.K and a low thermal expansion coefficient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesives (acrylics, urethanes, silicones, polyimides, epoxies) are used, then they provide basic bonding capability, but they degrade or decompose at high temperatures (above 200-300°C) used in microelectronic device manufacturing
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using a preceramic polymer matrix instead of conventional polymers. This fundamental material parameter change enables the adhesive to withstand temperatures above 350°C without degradation, resolving the thermal stability issue while maintaining bonding capability.
Solution Approach 2:
The patent creates a composite adhesive material combining preceramic polymer matrix with thermally conductive fillers (such as aluminum nitride, boron nitride, or silicon carbide particles). This composite structure provides both high temperature resistance from the preceramic matrix and enhanced thermal conductivity from the fillers, simultaneously addressing thermal stability and heat dissipation requirements.
2Loss of energy
If conventional adhesives are used, then they provide electrical insulation, but they lack optimal thermal conductivity for efficient heat dissipation in microelectronic devices
Solution Approach 1:
The patent incorporates thermally conductive fillers (aluminum nitride, boron nitride, silicon carbide) into the preceramic polymer matrix to enhance thermal conductivity. These fillers form thermal pathways that efficiently conduct heat away from hot spots, while the preceramic polymer matrix maintains electrical insulation properties, thus resolving the contradiction between thermal conductivity and electrical insulation.
Solution Approach 2:
The patent creates local thermal conductivity enhancement by strategically distributing thermally conductive fillers within the adhesive matrix. The fillers are concentrated in regions requiring efficient heat dissipation, while the polymer matrix maintains electrical insulation throughout, allowing different regions to have optimized properties for their specific functions.
3Stability of the object's composition
If conventional adhesives are used, then they provide bonding strength, but they exhibit significant variation in coefficient of thermal expansion that causes stress and potential failure at temperature extremes
Solution Approach 1:
The patent changes the thermal expansion parameter by selecting a preceramic polymer matrix with inherently lower and more stable coefficient of thermal expansion compared to conventional polymers. This material parameter change reduces thermal stress during temperature cycling, preventing bonding failure while maintaining bonding strength through the preceramic polymer's structural integrity.
4Ease of manufacture
If granular adhesive forms are used, then they may provide good thermal properties, but they make application cumbersome in microelectronics manufacturing
Solution Approach 1:
The patent changes the physical state parameter of the adhesive from granular to a curable composition form (paste, gel, or liquid). This parameter change enables easy application using conventional microelectronics assembly methods (dispensing, printing, or lamination) while maintaining reliable thermal conductivity through the embedded thermally conductive fillers in the curable matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition provides thermal stability and conductivity suitable for microelectronics manufacturing, allowing for successful layer transfers without degradation at high temperatures and maintaining mechanical integrity, with bonding forces comparable to conventional epoxy glues.
Implementation Method 1
The preceramic polymer advantageously exhibits temperature resistance exceeding 350°C, allowing it to be transformed into a ceramic at high temperatures
Implementation Method 2
thermally conductive and electrically insulating inorganic fillers... exhibits a thermal conductivity of at least 2 W/mK
Data Source
Figure 1~3
Figure 4~7
AI summary
The present invention relates to an adhesive composition comprising a polymer, inorganic fillers and at least one organic solvent, in which: - the polymer is at least a preceramic polymer, advantageously silicon-based, - the fillers comprise one or more types of thermally conductive and electrically insulating inorganic fillers.