Precise Assembly Mechanism for Semiconductor Wafer Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The assembly of small probes onto a holding tray in semiconductor wafer testing and packaging is challenging due to their tiny size (24.5 μm from 150 μm) and time-consuming process, leading to increased production costs.
Innovation Solution
A precise assembly mechanism that adjusts the position of each through orifice on the holding tray using a visual sensing unit, aligns the tip of each material with the orifice, and employs a clamp unit with motors to drive a pick module for accurate insertion, comprising a control unit, loading unit, and visual sensing unit with multiple sensors to ensure correct positioning and profiling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the probe size is reduced to 24.5 μm from 150 μm, then the testing precision is improved, but the assembly difficulty increases
Solution Approach 1:
The patent replaces manual mechanical assembly with an automated assembly system that uses visual sensing (optical field) to locate probes and through-orifices, and robotic manipulation to perform the insertion. This substitution of mechanical manual operation with automated vision-guided systems resolves the assembly difficulty caused by miniaturization while maintaining the small probe size for testing precision.
Solution Approach 2:
The visual sensing unit creates an optical copy or image of the probe positions and through-orifice locations, allowing the system to identify and align components without direct mechanical contact during the positioning phase. This copying approach enables precise handling of miniaturized components that would be difficult to manipulate mechanically.
2Ease of manufacture
If manual assembly method is used, then the equipment cost is reduced, but the assembly time increases
Solution Approach 1:
The assembly system performs self-positioning and self-alignment through the visual sensing unit that automatically identifies probe locations and through-orifice positions without requiring external guidance or manual intervention. The system serves itself by using its own sensing capabilities to guide the assembly process, reducing both time and operational complexity.
Solution Approach 2:
The visual sensing unit performs preliminary identification and positioning of both the probes and through-orifices before the actual insertion action takes place. This preliminary action of locating and aligning components in advance enables the rapid execution of the insertion operation, significantly reducing overall assembly time.
3Manufacturing precision
If visual sensing unit is added for precise positioning, then the assembly precision is improved, but the device complexity increases
Solution Approach 1:
The visual sensing unit serves multiple functions: it identifies probe positions, locates through-orifices, determines alignment requirements, and guides the insertion process. By consolidating these multiple positioning and alignment functions into a single multi-functional sensing system, the patent achieves high assembly precision without proportionally increasing device complexity.
Solution Approach 2:
The patent combines the sensing, positioning, and alignment functions into an integrated visual sensing unit that performs all these tasks simultaneously or in sequence. This merging of multiple functions into a single subsystem reduces the overall complexity compared to having separate devices for each function, while maintaining high assembly precision.
Data Source
AI summary
A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a clamper and moves in a third direction Z, the loading unit includes a slider moving in a first direction X or a second direction Y, the holding tray moves in the first direction X or the second direction Y. The visual sensing unit includes a first sensor for identifying a position of an upper rim of each of at least one through orifice on a holding tray, a second sensor for identifying positions of a lower rim of each through orifice and a tip of each of multiple materials, a third sensor for determining a profile of each material in the second direction Y, and a fourth sensor configured to judge the profile of each material in the first direction X.