Precision Capacitor Dielectric Stack Voltage Coefficient Control

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Solution Overview

Problem

Integrated circuits with analog-to-digital converters face limitations in precision due to nonlinear capacitance response to voltage, which restricts the accuracy of converting analog signals to digital values, primarily because existing precision capacitors have high voltage-dependent capacitance coefficients.

Innovation Solution

The development of an integrated circuit with an embedded precision capacitor featuring a dielectric stack of silicon dioxide and silicon nitride, where the silicon nitride has an atomic hydrogen content less than 25% and is deposited using N2 as a nitrogen source with radio frequency low frequency power, reducing the quadratic voltage coefficient to less than 0.5 ppm/V^2, thereby enhancing the breakdown voltage and reducing capacitance nonlinearity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional precision capacitors are used in integrated circuits, then analog-to-digital conversion can be performed, but the capacitance exhibits high voltage-dependent coefficients (nonlinearity) which limits measurement precision

Engineering Contradiction:
Improveanalog-to-digital conversion precisionVSAvoidcapacitance voltage coefficient control
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent changes the chemical composition parameters of the silicon nitride dielectric by controlling the atomic hydrogen content to be less than 25% (preferably less than 20%). This parameter change in the dielectric material composition directly reduces the capacitance quadratic voltage coefficient to less than 0.5 ppm/V², thereby improving measurement precision while maintaining manufacturability through controlled deposition processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite dielectric stack structure consisting of alternating layers of silicon dioxide and silicon nitride. This composite material approach combines the beneficial properties of both materials: silicon dioxide provides stability while the modified silicon nitride (with reduced hydrogen content) provides low voltage coefficient. The composite structure achieves superior capacitance linearity that neither material could achieve alone

Inventive Principle:
Principle #40Composite materials

2Reliability

If higher breakdown voltage is achieved through material modification, then capacitor precision improves, but the manufacturing process complexity increases due to specific deposition requirements

Engineering Contradiction:
Improvebreakdown voltageVSAvoiddeposition process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent modifies the deposition process parameters by applying both radio frequency (RF) and low frequency (LF) power during plasma-enhanced chemical vapor deposition of silicon nitride. This dual-frequency power approach enables precise control of the dielectric's atomic hydrogen content and breakdown voltage characteristics. The process achieves high reliability (breakdown voltage > 30V) while managing complexity through standardized semiconductor manufacturing techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses nitrogen gas (N2) as the nitrogen source during silicon nitride deposition, which serves multiple functions: it provides the necessary nitrogen for dielectric formation, acts as a plasma gas for RF-LF power coupling, and enables control of hydrogen content. This multi-functional approach consolidates several process requirements into a single deposition step, reducing overall process complexity while achieving high breakdown voltage

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If capacitor size is reduced to decrease integrated circuit area, then cost and area are reduced, but maintaining high precision becomes more difficult due to higher voltage coefficients in smaller capacitors

Engineering Contradiction:
Improveintegrated circuit areaVSAvoidcapacitance precision
Core Design Contradiction:
Area of stationary objectVSMeasurement precision

Solution Approach 1:

The patent changes the fundamental voltage coefficient parameter of the capacitor dielectric by controlling hydrogen content in silicon nitride to less than 25%. This parameter change reduces the quadratic voltage coefficient to less than 0.5 ppm/V², which maintains high precision even in miniaturized capacitors. The improved material properties allow precision capacitors to be scaled down without sacrificing accuracy, enabling smaller integrated circuit area while maintaining measurement precision

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases the breakdown voltage of the capacitor, allowing for higher precision in analog-to-digital conversions, enabling the use of smaller capacitors and reducing the area and cost of integrated circuits while maintaining high precision.

Implementation Method 1

depositing over the capacitor first plate a dielectric stack of alternating layers of plasma enhanced chemical vapor deposition (PECVD) silicon dioxide and PECVD silicon nitride

Methodology Applied
Scientific EffectPlasma enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Implementation Method 2

the silicon nitride is deposited using N2 as a nitrogen source while applying radio frequency low frequency power

Methodology Applied
Scientific EffectRadio frequency low frequency power deposition: Plasma

Data Source

PatentUS11670671B2Precision capacitor
Publication Date: 2023.06.06 TEXAS INSTRUMENTS INC
  • US11670671B2 patent drawing
  • US11670671B2 patent drawing
  • US11670671B2 patent drawing

AI summary

In a described example, an integrated circuit includes a capacitor first plate; a dielectric stack over the capacitor first plate comprising silicon nitride and silicon dioxide with a capacitance quadratic voltage coefficient less than 0.5 ppm/V2; and a capacitor second plate over the dielectric stack.