Precision Etchant Dispensing for Maskless 3D Substrate Etching
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Solution Overview
Problem
The photolithography process for microelectronic device fabrication is time-consuming, prone to alignment issues, limited to two-dimensional surfaces, and requires custom masks and photoresist material, making it inefficient for selective etching of small features and 3D substrates.
Innovation Solution
A precision dispense process with a programmable toolpath capability and precise etchant dispense volume control allows for selective etching of features on substrates without photolithography, enabling etching of 3D surfaces and post-build processing by depositing etchant material according to programmed instructions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used for selective etching, then alignment precision and feature protection are improved, but processing time and device complexity increase
Solution Approach 1:
The patent extracts and eliminates the photolithography step from the traditional etching process. By using a precision dispense apparatus to directly deposit etchant material according to programmed toolpaths, the method removes the need for photomasks, photoresist materials, and associated alignment procedures, thereby significantly reducing processing time while maintaining etching precision through digital control
Solution Approach 2:
The patent replaces the mechanical photolithography system (photomasks, aligners, spin coaters) with a programmable precision dispense system. The mechanical alignment and masking operations are substituted with digital toolpath programming and automated dispensing, reducing both device complexity and processing time while achieving comparable or superior precision
2Manufacturing precision
If photolithography process is used, then selective etching capability is improved, but adaptability to 3D surfaces and post-build processing is limited
Solution Approach 1:
The patent employs a dynamic precision dispense apparatus with programmable toolpaths that can adapt to various substrate geometries. The system can dynamically adjust dispensing parameters, toolpath trajectories, and etchant flow rates to accommodate 3D surfaces and different feature configurations, providing both selective etching capability and versatility for post-build processing
Solution Approach 2:
The precision dispense apparatus serves multiple functions: it can perform selective etching on 2D and 3D surfaces, modify existing features, create new features, and process various substrate types without requiring different equipment or materials. This multi-functionality achieves both selective etching precision and broad adaptability
3Manufacturing precision
If photolithography process is used, then feature protection accuracy is improved, but device complexity and material requirements increase
Solution Approach 1:
The patent removes the complex photolithography subsystem (photomasks, photoresist, aligners, spin coaters, bakers) and replaces it with a simplified precision dispense system. The feature protection function is achieved directly through programmed dispensing of etchant only where needed, eliminating multiple process steps and reducing device complexity while maintaining protection accuracy
Solution Approach 2:
The precision dispense system uses programmed toolpaths to self-determine where etching should occur, eliminating the need for external masking layers. The system automatically deposits etchant only on target features based on digital models, achieving feature protection accuracy through intelligent material placement rather than physical barriers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise, maskless etching of custom toolpaths on 3D substrates, allowing for advanced substrate designs and precise control over etching depth, eliminating the limitations of traditional photolithography.
Implementation Method 1
providing a precision dispense apparatus having a precision dispense tool with programmable toolpath capability and precise etchant dispense volume control
Implementation Method 2
etching the at least one feature in the surface of the electronic substrate by depositing etchant material onto the surface of the electronic substrate via the precision dispense tool
Data Source
AI summary
Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.