Pre-conductive Array for Micro-electronic Conductive Structures

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Solution Overview

Problem

Conventional methods for building conductive structures on target circuit substrates, such as SMT and anisotropic conductive paste application, are inefficient and wasteful, particularly for micro-electronic devices, due to lack of precision and high material costs, leading to wasted conductive particles and varying manufacturing costs across different factories.

Innovation Solution

A pre-conductive array is formed on a target circuit substrate with conductive electrode groups and particles, where the density of particles within pre-conductive structures is greater than between them, optimizing particle utilization and reducing waste, and allowing for precise alignment and application across various electronic device scales.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If anisotropic conductive paste with high particle fill rate is used, then the possibility of conducting conductive pads is improved, but the manufacturing cost increases due to waste of conductive particles

Engineering Contradiction:

Improveconductive connection reliabilityVSAvoidconductive particle waste

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The conductive paste is segmented into discrete conductive particles distributed on a substrate, rather than using a continuous paste coating. This allows precise placement of particles only where conductive connections are needed, eliminating waste from excessive particle fill rate while maintaining reliable conductive paths between pads

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Conductive particles are pre-positioned on the substrate before the bonding process, forming a predetermined pattern that matches the required electrical connections. This preliminary arrangement ensures that particles are only placed where needed, preventing waste while guaranteeing conductive reliability for micro-electronic devices

Inventive Principle:

Principle #10Preliminary action

2Loss of substance

If anisotropic conductive paste with low particle fill rate is used, then the manufacturing cost is reduced, but the conductive connection reliability deteriorates

Engineering Contradiction:

Improveconductive particle wasteVSAvoidconductive connection reliability

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The conductive particle distribution exhibits local quality variation: high particle density is concentrated precisely at locations where conductive connections are required (between conductive pads), while areas where no connections are needed have zero or minimal particle density. This localized optimization ensures reliable conduction where needed while eliminating waste elsewhere

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The system uses the substrate pattern or electrode arrangement itself to guide and determine the precise placement of conductive particles, eliminating the need for external alignment processes. The conductive particles self-organize according to the underlying structure, ensuring they land exactly where conductive connections are needed without over-application

Inventive Principle:

Principle #25Self-service

3Ease of manufacture

If conventional SMT process is used, then the manufacturing process is simple, but the precision is insufficient for micro-electronic devices with size of 100 nm or smaller

Engineering Contradiction:

Improveprocess simplicityVSAvoidalignment precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical SMT pick-and-place process with a direct transfer method where conductive particles are moved and positioned using controlled deposition or self-assembly mechanisms. This substitution enables sub-100 nm precision by eliminating the mechanical resolution limits of conventional SMT equipment while maintaining process simplicity through direct particle placement

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Adaptability or versatility

If different factories use different coating processes for anisotropic conductive paste, then the manufacturing flexibility is improved, but the thickness and particle distribution become inconsistent

Engineering Contradiction:

Improvemanufacturing process flexibilityVSAvoidpaste thickness consistency

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The invention changes the fundamental parameters of the conductive material application: instead of varying paste thickness and particle concentration (continuous parameters difficult to control), the system uses discrete particle placement with controlled position, density, and arrangement. This parameter transformation enables consistent particle distribution across different factories while maintaining manufacturing flexibility for various device configurations

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10431561B2Pre-conductive array disposed on target circuit substrate and conductive structure array thereof

Publication Date: 2019.10.01 LG DISPLAY CO LTD

AI summary

A pre-conductive array disposed on a target circuit substrate comprises a plurality of conductive electrode groups disposed on the target circuit substrate, and at least a conductive particle dispose on each of conductive electrodes of a part or all of the conductive electrode groups. The at least a conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array.