Interference-Fit Precursor Container Assembly for Stable Vaporization
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Solution Overview
Problem
Existing fluid systems for vaporizing liquid process fluids in semiconductor processing face challenges in efficiently controlling temperature and pressure to maintain consistent vapor concentration, leading to potential condensation and system design complexity.
Innovation Solution
A container assembly with a vessel and jacket made of materials with different thermal conductivities, affixed with an interference fit, coupled with thermoelectric heat pumps and heat sinks to regulate heat transfer and maintain precise temperature control of liquid precursors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-material vessel is used for vaporizing liquid precursors, then the system structure is simple, but temperature control precision and heat transfer efficiency are insufficient
Solution Approach 1:
The vessel is constructed with a composite structure comprising an inner vessel made of stainless steel and an outer vessel made of aluminum alloy, with thermal conductive material filling the annular space between them. This composite construction combines the corrosion resistance of stainless steel with the high thermal conductivity of aluminum alloy, achieving precise temperature control while maintaining structural integrity.
Solution Approach 2:
The inner stainless steel vessel is nested within the outer aluminum alloy vessel, creating a multi-layer composite structure. This nested configuration allows the system to benefit from both materials' properties while maintaining a compact overall structure, resolving the contradiction between temperature control precision and structural complexity.
2Loss of energy
If thermal conductive material is added between vessel layers, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
Thermal conductive material is placed in the annular space between the inner and outer vessels, creating efficient thermal coupling between the two vessel layers. This material fills the space effectively and ensures uniform heat distribution, improving heat transfer efficiency while the modular design keeps manufacturing manageable.
3Loss of energy
If interference fit is used to affix jacket to vessel, then thermal contact resistance decreases, but assembly difficulty increases
Solution Approach 1:
The interference fit between the outer vessel and jacket is designed to create intimate thermal contact, minimizing thermal contact resistance. The slight dimensional interference ensures continuous thermal coupling between components, effectively reducing energy loss through poor thermal contact while the standardized fit dimensions keep assembly straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable vaporization and delivery of liquid precursors, minimizing condensation risks and simplifying system design by maintaining temperature within a predetermined range, enhancing operational safety and efficiency.
Implementation Method 1
The jacket extends about the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is greater than the first thermal conductivity and the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket.
Implementation Method 2
the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket
Implementation Method 3
coupled with thermoelectric heat pumps and heat sinks to regulate heat transfer and maintain precise temperature control of liquid precursors
Implementation Method 4
Vaporization of the liquid process fluid may be accomplished by introducing a gas into the liquid process contained within the fluid source to charge a headspace within the fluid source with vaporized liquid process fluid
Data Source
AI summary
A container assembly is provided. The container assembly includes a vessel, a conduit and a jacket. The vessel is formed from a first material having a first thermal conductivity, the conduit is seated in the vessel and is in communication with an interior of the vessel, and the jacket extends about the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is greater than the first thermal conductivity and the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket. Chamber arrangements and semiconductor processing systems, material layer deposition methods and methods of making container assemblies are provided.