Precursor Pulse Deposition for Uniform Film Coverage on Recessed Substrates
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform film thickness and step coverage, particularly in forming films on substrates with recesses, due to non-uniform adsorption of intermediates generated from precursor gases.
Innovation Solution
A method involving divisional supply of precursor gas, pre-filling in a storage, and subsequent flash supply into the process chamber, followed by exhaust, to enhance uniform adsorption of intermediates and improve film quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If precursor gas is continuously supplied to form a film on the substrate, then the film formation efficiency is improved, but the in-plane film thickness uniformity deteriorates due to non-uniform adsorption of intermediates
Solution Approach 1:
The precursor gas supply is divided into multiple discrete pulses rather than continuous supply. Each pulse introduces a controlled amount of precursor gas that decomposes to form intermediates, which are then exhausted before the next pulse. This segmentation prevents intermediate accumulation and promotes uniform adsorption across the substrate surface, improving in-plane film thickness uniformity while maintaining film formation efficiency through optimized pulse timing and duration.
Solution Approach 2:
The film formation process uses periodic cycles of precursor gas supply followed by exhaust phases. The precursor gas is supplied in periodic pulses, allowing intermediates to be introduced, adsorb uniformly onto the substrate, and then be exhausted before the next pulse. This periodic action creates a rhythm of intermediate introduction and removal that ensures uniform distribution across the substrate while maintaining high film formation rates through optimized cycle frequency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved step coverage and in-plane film thickness uniformity by preferentially adsorbing the first intermediate uniformly across the substrate surface, reducing the adsorption of second intermediates and enhancing film quality.
Implementation Method 1
adsorption of intermediates generated from precursor gases
Implementation Method 2
a substrate processing process in which a precursor gas or a reaction gas is supplied to a substrate to form a film on the substrate
Data Source
AI summary
There is provided a technique that includes forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a precursor gas from a precursor gas supply line into a process chamber in which the substrate is accommodated; and (b) supplying a reaction gas into the process chamber in which the substrate is accommodated, wherein in (a), the precursor gas is divisionally supplied to the substrate a first plural number of times, the precursor gas is pre-filled in a storage installed in the precursor gas supply line and then supplied into the process chamber when the precursor gas is supplied for the first time, and an inside of the process chamber is exhausted before supplying the precursor gas for the second time.