3D Patterned Precursor Source Container for Thin Film Deposition
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Solution Overview
Problem
Traditional solid precursor source containers in thin film deposition systems suffer from non-uniform heat transfer and unstable precursor vapor concentration due to limited contact area, leading to nonuniform thickness and poor coverage of deposited thin films.
Innovation Solution
A precursor source container with a three-dimensional (3D) pattern on its interior surface to enhance heat transfer and stability, combined with a precursor control unit for real-time monitoring and adjustment of operational parameters to maintain desired vapor concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a traditional solid precursor source container with limited contact area is used, then the device complexity is low, but the heat transfer uniformity and precursor vapor concentration stability deteriorate
Solution Approach 1:
The patent applies dimensionality change by transitioning from a flat interior surface to a three-dimensional patterned surface with protrusions and recesses. This 3D structure increases the contact area between the precursor source and container wall, enabling more uniform heat distribution and stable vapor concentration without significantly increasing device complexity
Solution Approach 2:
The patent employs a porous or textured surface structure on the container interior wall. This porous-like 3D pattern provides increased surface area for thermal contact with the precursor source, improving heat transfer uniformity and vapor concentration stability while maintaining a relatively simple overall container design
2Device complexity
If a traditional solid precursor source container with limited contact area is used, then the device complexity is low, but the thin film thickness uniformity deteriorates
Solution Approach 1:
By introducing a 3D patterned surface with protrusions and recesses, the patent achieves uniform heat distribution across the precursor source, which directly translates to uniform thin film thickness deposition. This dimensional transformation resolves the trade-off between simple container structure and manufacturing precision
Solution Approach 2:
The porous/textured interior surface ensures consistent thermal contact with the precursor source material, leading to uniform vapor generation and consequently uniform thin film thickness across the substrate, while avoiding complex device modifications
3Stability of the object's composition
If a precursor source container with 3D pattern is used, then the heat transfer uniformity improves, but the device complexity increases
Solution Approach 1:
The patent implements thermal uniformity improvement through a 3D patterned surface that can be integrated into the existing container design. This dimensional approach provides enhanced heat distribution without requiring fundamentally new device architectures, thus limiting the increase in device complexity
Solution Approach 2:
The porous or textured surface structure achieves improved thermal uniformity by increasing contact area between the precursor source and container wall. This approach enhances heat transfer efficiency while maintaining a relatively simple container structure that can be manufactured with standard techniques
4Stability of the object's composition
If a precursor source container with 3D pattern is used, then the precursor vapor stability improves, but the device complexity increases
Solution Approach 1:
The 3D patterned surface stabilizes precursor vapor concentration by ensuring uniform heat distribution to the precursor source. This dimensional transformation achieves vapor stability without requiring complex control systems or multiple components, thus limiting device complexity increase
Solution Approach 2:
The porous/textured interior surface provides stable thermal contact with the precursor source, resulting in consistent vapor generation and concentration. This approach achieves vapor stability through a relatively simple structural modification rather than complex device architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D pattern improves thermal uniformity and stability of the precursor vapor, reducing cluster formation and maintaining concentration within a target range, resulting in improved thin film quality and uniformity.
Implementation Method 1
A precursor source container with a three-dimensional (3D) pattern on its interior surface to enhance heat transfer
Implementation Method 2
heating the precursor source container to evaporate the precursor source to form a precursor vapor
Data Source
AI summary
A thin film deposition system includes: a first precursor supply system configured to generate and supply a first precursor vapor from a first precursor source, the first precursor supply system comprising a first precursor source container, wherein at least a portion of an interior surface of the first precursor source container has a three-dimensional (3D) pattern, wherein the 3D pattern comprises a plurality of area enlarging elements configured to enlarge a total contact area of the interior surface of the first precursor source container with the first precursor source stored therein; and a deposition chamber in gas communication with the first precursor source container, the deposition chamber configured to receive the first precursor vapor and deposit a layer of a first precursor source onto a substrate placed in the deposition chamber.