Precursor vessel cooling assembly, system including the assembly, and methods of using same
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Solution Overview
Problem
Existing gas-phase reactor systems are inefficient in cooling precursor vessels, particularly when the precursor is in liquid or solid form, and fail to provide desired temperature control.
Innovation Solution
A precursor vessel cooling assembly incorporating a thermoelectric cooling device and a fluid-cooled plate, with a pump to circulate cooling fluid and a heat exchanger to manage temperature, ensuring efficient heat removal and longevity of the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used for precursor vessels, then the system structure is simple, but the temperature control efficiency is insufficient and cannot achieve desired cooling performance
Solution Approach 1:
The cooling system is divided into two independent modules: a thermoelectric cooling device for active temperature control and a fluid-cooled plate for heat dissipation. This segmentation allows each module to perform its specialized function optimally, with the thermoelectric device providing precise temperature control and the fluid-cooled plate efficiently removing heat, thereby resolving the contradiction between simple structure and effective temperature control.
Solution Approach 2:
A thermal interface material is introduced as an intermediary between the thermoelectric cooling device and the precursor vessel, and another between the thermoelectric device and the fluid-cooled plate. This intermediary ensures efficient thermal contact and heat transfer across the interfaces, improving the overall temperature control precision without complicating the system architecture.
2Temperature
If thermoelectric cooling device is used alone, then the device can provide active cooling, but the heat removal efficiency is insufficient leading to reduced device lifetime
Solution Approach 1:
The patent merges a thermoelectric cooling device with a fluid-cooled plate into an integrated cooling assembly. The thermoelectric device provides active cooling capability while the fluid-cooled plate continuously removes heat through circulating coolant. This combination allows the thermoelectric device to operate within safe temperature ranges, preventing overheating and extending device lifetime while maintaining effective cooling performance.
Solution Approach 2:
The fluid-cooled plate implements continuous heat removal through constant circulation of cooling fluid. This continuous action prevents heat accumulation that would otherwise limit the thermoelectric device's operational duration, enabling sustained cooling operation and extending the overall system lifetime.
3Device complexity
If no active cooling is provided, then the system is simpler, but the precursor vessel cannot be cooled to desired temperatures below ambient
Solution Approach 1:
The patent replaces conventional mechanical cooling systems (such as compressors and refrigeration cycles) with a thermoelectric cooling device that uses solid-state Peltier effect. This substitution eliminates complex mechanical components while providing precise electronic control of cooling, achieving desired sub-ambient temperatures with a simpler, more reliable solid-state system.
Solution Approach 2:
The fluid-cooled plate utilizes hydraulic principles by circulating liquid coolant through channels to remove heat. This hydraulic approach provides efficient heat transfer and can be controlled by adjusting flow rate, offering a simple yet effective method to enhance cooling capacity without adding mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly effectively cools the precursor vessel to desired temperatures (0° C to 20° C below ambient) while maintaining the efficiency and longevity of the thermoelectric device, suitable for applications like CVD and ALD processes.
Implementation Method 1
The first surface can be in thermal contact with a surface of the precursor vessel. The second surface can be in thermal contact with the fluid-cooled plate.
Implementation Method 2
a thermoelectric cooling device, and a fluid-cooled plate. The thermoelectric cooling device can include a first surface and a second surface.
Implementation Method 3
The fluid-cooled plate can include a conduit, which can include a cooling fluid therein.
Implementation Method 4
The assembly can further include a pump to circulate the cooling fluid through the conduit.
Implementation Method 5
Exemplary systems can further include a heat exchanger to cool the cooling fluid.
Data Source
AI summary
A precursor vessel cooling assembly, a reactor system including the assembly, and methods of using the assembly and system are disclosed. The precursor vessel cooling assembly includes a thermoelectric cooling device and a fluid-cooled plate to maintain a desired temperature of a precursor vessel or other portion of the precursor vessel cooling assembly.