Pre-Deoxide Bonding of Package Connectors Without Residue
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Solution Overview
Problem
Existing bonding processes for integrating package components face challenges in efficiently removing oxide layers from electrical connectors, leading to residue issues and difficulties in accessing these layers for post-bonding cleaning, especially when using flux or forming gases.
Innovation Solution
The proposed method involves performing oxide removal processes, such as plasma reduction or mass de-oxide processes, on electrical connectors before the bonding of package components, ensuring that oxide layers are removed prior to placement, thereby eliminating the need for post-bonding cleaning and enhancing the reliability of the bonded structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If oxide removal is performed after bonding using flux or forming gases, then oxide layers on electrical connectors can be removed, but residue formation occurs and post-bonding cleaning becomes difficult
Solution Approach 1:
The patent applies preliminary action by performing oxide removal before the bonding process. The method involves picking up a first package component, removing oxide layers from its electrical connectors, and then placing it on a second package component for bonding. This sequence ensures oxide removal occurs when connectors are accessible, preventing residue entrapment that would occur with post-bonding cleaning attempts.
2Reliability
If oxide removal is performed after bonding, then oxide layers can be addressed, but access to electrical connectors becomes difficult
Solution Approach 1:
The patent performs oxide removal as a preliminary step before bonding operations. By removing oxides from electrical connectors while they are still accessible on individual package components, the method eliminates the difficulty of accessing buried connectors after bonding. The sequence of picking up, de-oxidizing, then placing components ensures connectors remain accessible during the critical oxide removal phase.
3Productivity
If traditional bonding process with post-bonding cleaning is used, then bonding can be completed, but cleaning residue from electrical connectors is difficult
Solution Approach 1:
The patent resequences operations to perform oxide removal before bonding rather than after. The method picks up a first package component, removes oxides from its electrical connectors, places it on a second package component, and then performs bonding. This preliminary oxide removal prevents residue entrapment, eliminating the need for difficult post-bonding cleaning while maintaining bonding productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that oxide layers are effectively removed before bonding, preventing residue formation and improving the reliability of the bonded package components by maintaining access to electrical connectors, thus simplifying the cleaning process and enhancing structural integrity.
Implementation Method 1
conducting a plasma of a forming gas to the metal oxide layer to reduce the metal oxide layer back to metal
Implementation Method 2
heating the first package component and the second package component to bond the first package component to the second package component
Implementation Method 3
a reflow is performed, so that solder regions on either the top dies or bottom dies are molten
Data Source
AI summary
A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.