Predictive Processor Thermal Management via Junction Temperature Forecasting

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Solution Overview

Problem

Current thermal management solutions for processor-based subsystems are reactive and inefficient, leading to performance degradation, increased heat flux, and potential processor aging due to high temperatures.

Innovation Solution

A predictive run-time thermal mitigation system that uses temperature and power sensors to measure current junction temperature and power consumption, predicts future temperatures, and initiates thermal mitigation actions before exceeding a preselected temperature threshold.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If reactive thermal management is used, then the system responds to temperature increases, but performance degradation occurs due to delayed response

Engineering Contradiction:
Improvethermal management effectivenessVSAvoidprocessor performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system performs preliminary thermal mitigation actions by predicting future temperature values based on current temperature and power consumption data. When the predicted temperature exceeds a threshold, the system proactively reduces power consumption before the actual temperature violation occurs, preventing performance degradation while maintaining thermal safety.

Inventive Principle:
Principle #10Preliminary action

2Temperature

If current thermal management approaches are used, then temperature sensing is performed, but heat flux increases due to reactive mitigation

Engineering Contradiction:
Improvejunction temperature controlVSAvoidheat flux
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The system predicts future temperature values using current temperature and power consumption measurements. By taking thermal mitigation actions before the temperature threshold is actually exceeded, the system reduces the magnitude and duration of thermal events, thereby reducing overall heat flux and energy loss while maintaining effective temperature control.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If higher algorithm complexity and system core frequencies are used, then processing power increases, but thermal management becomes increasingly important and difficult

Engineering Contradiction:
Improveprocessing powerVSAvoidthermal management complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system uses a prediction model that takes current temperature and power consumption values to forecast future temperature states. This approach simplifies thermal management by enabling proactive control decisions based on predicted states rather than reacting to actual temperature violations, reducing the complexity of real-time thermal control while supporting high processing powers.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12314099B2Predictive runtime thermal management systems and methods
Publication Date: 2025.05.27 QUALCOMM INC
  • US12314099B2 patent drawing
  • US12314099B2 patent drawing
  • US12314099B2 patent drawing

AI summary

A system for performing predictive run-time thermal mitigation in a processor uses at least a first temperature sensor and a first power sensor or meter to measure a junction temperature, TJUNC, value and power consumption, PTOTAL, value in the processor and predicts what a temperature, TEMPPRED, value of the processor will be in a later clock cycle of the processor based at least in part on the TJUNC and PTOTAL values. If the TEMPPRED value exceeds a preselected temperature threshold, THTEMP, value, one or more thermal mitigation actions are taken to ensure that a future TJUNC value measured n sample periods from the current sample period k of the processor will not exceed the THTEMP value.