Pre-formed Interposer IC Packaging with Integrated Passive Devices
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Solution Overview
Problem
Conventional integrated circuit packaging systems face challenges in achieving high connectivity, low cost manufacturing, and reduced size while maintaining reliability and performance, especially in miniaturized portable devices.
Innovation Solution
The integration of a pre-formed interposer with integrated passive devices and through vias, allowing for reliable and flexible connections between integrated circuits, and eliminating separate manufacturing steps for passive components, along with a method of encapsulation that includes attaching lower and upper integrated circuits over a substrate and forming an encapsulation over the interposer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages use resin molding and stacking approaches to achieve miniaturization, then packaging density increases and size decreases, but manufacturing flexibility and reliability deteriorate
Solution Approach 1:
The patent divides the package into separate modular components: a substrate, multiple integrated circuit dice, and an overmold portion. This segmentation allows each component to be manufactured independently with optimized processes, then assembled together, thereby maintaining manufacturing flexibility while achieving compact packaging.
Solution Approach 2:
The patent implements nesting by placing multiple integrated circuit dice within the overmold portion that is formed over the substrate. The overmold encapsulates and protects the dice while maintaining electrical connections through vias, achieving miniaturization without sacrificing manufacturing flexibility.
2Quantity of substance
If conventional packages stack multiple integrated circuit dice or use package on package approaches to increase density, then packaging density improves, but manufacturing complexity and cost increase
Solution Approach 1:
The overmold portion serves multiple functions simultaneously: it provides mechanical support for the integrated circuit dice, establishes electrical connections through integrated vias, provides environmental protection through encapsulation, and enables thermal management. This multi-functionality reduces the number of separate components and manufacturing steps, thereby reducing complexity while achieving high packaging density.
3Volume of moving object
If conventional packages are miniaturized to reduce size and thickness for portable devices, then portability improves, but connectivity and performance deteriorate
Solution Approach 1:
The substrate acts as an intermediary component that provides a stable foundation for mounting multiple integrated circuit dice in close proximity. The substrate's vias and conductive traces serve as intermediaries for electrical connections, ensuring reliable connectivity even as the overall package size is reduced for portable applications.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate; mounting a pre-formed interposer, having an interposer through via and an integrated passive device, over the lower integrated circuit with the interposer through via coupled to the first through via; attaching an upper integrated circuit, having a second through via, over the pre-formed interposer; and forming an encapsulation over the upper integrated circuit and the pre-formed interposer.